TE0715-04-30-1I3
Manufacturer No:
TE0715-04-30-1I3
Manufacturer:
Description:
IC MOD CORTEX-A9 125MHZ 1GB 32MB
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
TE0715-04-30-1I3 Specifications
-
TypeParameter
-
Operating Temperature-40°C ~ 85°C
-
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
-
Connector TypeSamtec LSHM
-
RAM Size1GB
-
Flash Size32MB
-
Speed125MHz
-
Co-ProcessorZynq-7000 (Z-7030)
-
Core ProcessorARM Cortex-A9
-
Module/Board TypeMCU, FPGA
-
PackagingBulk
-
Product StatusObsolete
-
SeriesTE0715
The TE0715-04-30-1I3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The TE0715-04-30-1I3 chips are designed to deliver high performance with a powerful processing unit and advanced features. 2. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Compact Size: The TE0715-04-30-1I3 chips are compact in size, making them suitable for applications with space constraints. 4. Versatility: These chips offer a wide range of interfaces and peripherals, allowing for versatile connectivity and integration with other components. 5. Scalability: The TE0715-04-30-1I3 chips are scalable, enabling easy customization and adaptation to different application requirements.Application Scenarios: 1. Industrial Automation: The TE0715-04-30-1I3 chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance and versatility. 2. Internet of Things (IoT): These chips are suitable for IoT applications, where low power consumption and compact size are essential for connecting and managing a large number of devices. 3. Embedded Systems: The TE0715-04-30-1I3 chips can be used in various embedded systems, such as robotics, automotive, or medical devices, where high performance and low power consumption are critical. 4. Data Acquisition and Processing: These chips can be utilized in applications that require data acquisition and processing, such as data loggers, measurement devices, or scientific instruments. 5. Edge Computing: The TE0715-04-30-1I3 chips can be employed in edge computing scenarios, where processing and analysis of data are performed at the edge of the network, enabling real-time decision-making and reducing latency.Overall, the TE0715-04-30-1I3 integrated circuit chips offer high performance, low power consumption, compact size, versatility, and scalability, making them suitable for a wide range of applications in various industries.
TE0715-04-30-1I3 Relevant information
-
ME-AA1-480-1E2-D12E-R2
Enclustra FPGA Solutions -
ME-AA1-270-2I2-D11E-R2
Enclustra FPGA Solutions -
AA1-480-2I3-D12E-NFX3-R2
Enclustra FPGA Solutions -
ME-XU7-6EG-1I-D11E-R5.0
Enclustra FPGA Solutions -
ME-XU7-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU7-15EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU9-5EV-1I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU9-4CG-1E-D11E-R3.0
Enclustra FPGA Solutions -
ME-XU9-7EV-2I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU1-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions