DLP-HS-FPGA3

DLP-HS-FPGA3

Manufacturer No:

DLP-HS-FPGA3

Manufacturer:

DLP Design Inc.

Description:

IC MODULE SPARTAN-3A 66MHZ 32MB

Datasheet:

Datasheet

Delivery:

Payment:

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DLP-HS-FPGA3 Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    3.000" L x 1.200" W (76.20mm x 30.50mm)
  • Connector Type
    USB - B, Pin Header
  • RAM Size
    32MB
  • Flash Size
    -
  • Speed
    66MHz
  • Co-Processor
    FT2232H
  • Core Processor
    Spartan-3A, XC3S1400A
  • Module/Board Type
    FPGA, USB Core
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    FPGA
The DLP-HS-FPGA3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance processing: These chips are designed to provide high-performance processing capabilities, making them suitable for applications that require real-time data processing and analysis. 2. Programmability: The chips are programmable, allowing users to customize and optimize their functionality according to specific application requirements. 3. Low power consumption: The chips are designed to be power-efficient, making them suitable for battery-powered devices or applications where power consumption is a concern. 4. High-speed data transfer: The chips support high-speed data transfer, enabling fast and efficient processing of large volumes of data. 5. Compact size: The chips are compact in size, making them suitable for applications where space is limited.Application scenarios: 1. Image and video processing: The high-performance processing capabilities of these chips make them suitable for applications such as image and video processing, including real-time video analytics, object recognition, and computer vision. 2. Artificial intelligence and machine learning: The programmability of these chips makes them suitable for applications in artificial intelligence and machine learning, including deep learning algorithms, neural network processing, and pattern recognition. 3. Data analytics: The high-speed data transfer capabilities of these chips make them suitable for applications in data analytics, including real-time data processing, data compression, and data encryption. 4. Communication systems: The low power consumption and compact size of these chips make them suitable for applications in communication systems, including wireless communication, network routers, and data transmission. 5. Industrial automation: The high-performance processing capabilities of these chips make them suitable for applications in industrial automation, including robotics, control systems, and sensor data processing.Overall, the DLP-HS-FPGA3 integrated circuit chips offer high-performance processing, programmability, low power consumption, and compact size, making them suitable for a wide range of applications in various industries.