DLP-HS-FPGA3
Manufacturer No:
DLP-HS-FPGA3
Manufacturer:
Description:
IC MODULE SPARTAN-3A 66MHZ 32MB
Datasheet:
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In Stock : 0
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DLP-HS-FPGA3 Specifications
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TypeParameter
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Operating Temperature0°C ~ 70°C
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Size / Dimension3.000" L x 1.200" W (76.20mm x 30.50mm)
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Connector TypeUSB - B, Pin Header
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RAM Size32MB
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Flash Size-
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Speed66MHz
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Co-ProcessorFT2232H
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Core ProcessorSpartan-3A, XC3S1400A
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Module/Board TypeFPGA, USB Core
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PackagingBulk
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Product StatusObsolete
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SeriesFPGA
The DLP-HS-FPGA3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance processing: These chips are designed to provide high-performance processing capabilities, making them suitable for applications that require real-time data processing and analysis. 2. Programmability: The chips are programmable, allowing users to customize and optimize their functionality according to specific application requirements. 3. Low power consumption: The chips are designed to be power-efficient, making them suitable for battery-powered devices or applications where power consumption is a concern. 4. High-speed data transfer: The chips support high-speed data transfer, enabling fast and efficient processing of large volumes of data. 5. Compact size: The chips are compact in size, making them suitable for applications where space is limited.Application scenarios: 1. Image and video processing: The high-performance processing capabilities of these chips make them suitable for applications such as image and video processing, including real-time video analytics, object recognition, and computer vision. 2. Artificial intelligence and machine learning: The programmability of these chips makes them suitable for applications in artificial intelligence and machine learning, including deep learning algorithms, neural network processing, and pattern recognition. 3. Data analytics: The high-speed data transfer capabilities of these chips make them suitable for applications in data analytics, including real-time data processing, data compression, and data encryption. 4. Communication systems: The low power consumption and compact size of these chips make them suitable for applications in communication systems, including wireless communication, network routers, and data transmission. 5. Industrial automation: The high-performance processing capabilities of these chips make them suitable for applications in industrial automation, including robotics, control systems, and sensor data processing.Overall, the DLP-HS-FPGA3 integrated circuit chips offer high-performance processing, programmability, low power consumption, and compact size, making them suitable for a wide range of applications in various industries.
DLP-HS-FPGA3 Relevant information
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