L138-FI-236-RL
Manufacturer No:
L138-FI-236-RL
Manufacturer:
Description:
IC MOD ARM926EJ-S 456MHZ 8KB
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L138-FI-236-RL Specifications
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TypeParameter
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Operating Temperature-40°C ~ 70°C
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Size / Dimension2.660" L x 2.000" W (67.60mm x 50.80mm)
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Connector TypeSO-DIMM-200
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RAM Size8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
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Flash Size512MB (NAND), 8MB (NOR)
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Speed456MHz
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Co-ProcessorTMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
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Core ProcessorARM926EJ-S, OMAP-L138
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Module/Board TypeMPU, DSP, FPGA Core
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PackagingBulk
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Product StatusObsolete
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SeriesMityDSP-L138F
The L138-FI-236-RL integrated circuit (IC) chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The L138-FI-236-RL chips are designed to provide high-performance processing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Features: The L138-FI-236-RL chips come with various integrated features, such as a digital signal processor (DSP), an ARM Cortex-A8 processor, and peripherals like UART, I2C, SPI, etc. This integration simplifies the design process and reduces the need for external components. 4. Connectivity Options: These chips offer multiple connectivity options, including Ethernet, USB, and various serial interfaces, enabling seamless integration with other devices or networks. 5. Real-Time Processing: The L138-FI-236-RL chips are capable of real-time processing, making them suitable for applications that require quick response times or time-sensitive operations.Application Scenarios: 1. Industrial Automation: The high-performance processing capabilities and real-time processing of the L138-FI-236-RL chips make them suitable for industrial automation applications, such as robotics, control systems, and machine vision. 2. Internet of Things (IoT): With their low power consumption and connectivity options, these chips can be used in IoT devices, such as smart home systems, wearable devices, or environmental monitoring sensors. 3. Audio and Speech Processing: The integrated DSP in the L138-FI-236-RL chips makes them ideal for audio and speech processing applications, including voice recognition, audio codecs, noise cancellation, and audio effects. 4. Medical Devices: The real-time processing capabilities and low power consumption of these chips make them suitable for medical devices, such as patient monitoring systems, portable medical instruments, or telemedicine applications. 5. Embedded Systems: The L138-FI-236-RL chips can be used in various embedded systems, including automotive electronics, consumer electronics, industrial control systems, and communication devices.These are just a few examples of the advantages and application scenarios of the L138-FI-236-RL integrated circuit chips. The specific use cases may vary depending on the requirements and design considerations of the target application.
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