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COMMPC8360E-10-2752FCR

COMMPC8360E-10-2752FCR

Manufacturer No:

COMMPC8360E-10-2752FCR

Manufacturer:

Beacon EmbeddedWorks

Description:

IC MOD POWERQUICC 667MHZ 256KB

Datasheet:

Datasheet

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COMMPC8360E-10-2752FCR Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    3.740" L x 3.740" W (95.00mm x 95.00mm)
  • Connector Type
    -
  • RAM Size
    256KB
  • Flash Size
    64MB (NAND), 8MB (NOR)
  • Speed
    667MHz
  • Co-Processor
    -
  • Core Processor
    PowerQUICC, MPC8360E
  • Module/Board Type
    MPU Core
  • Packaging
    Box
  • Product Status
    Obsolete
  • Series
    -
The COMMPC8360E-10-2752FCR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a clock speed of 1.0 GHz, making them suitable for demanding applications. 2. Power Efficiency: The chips are power-efficient, which helps in reducing energy consumption and extending battery life in portable devices. 3. Integrated Features: They come with integrated features like Ethernet controllers, USB ports, and memory controllers, reducing the need for additional components and simplifying the design process. 4. Scalability: The chips offer scalability options, allowing for easy integration into various systems and applications. 5. Reliability: These chips are known for their reliability and stability, making them suitable for mission-critical applications.Application Scenarios: 1. Networking Equipment: The COMMPC8360E-10-2752FCR chips are commonly used in networking equipment like routers, switches, and gateways. Their high performance and integrated features make them ideal for handling network traffic and data processing. 2. Industrial Automation: These chips find applications in industrial automation systems, where they can be used for controlling and monitoring processes, data acquisition, and communication. 3. Embedded Systems: The chips are widely used in embedded systems, such as automotive electronics, medical devices, and consumer electronics. Their power efficiency and integrated features make them suitable for various embedded applications. 4. Communication Systems: The chips can be used in communication systems like base stations, wireless access points, and telecommunication infrastructure. Their high performance and reliability ensure efficient data processing and communication. 5. Defense and Aerospace: The chips are also utilized in defense and aerospace applications, where their reliability and stability are crucial. They can be used in radar systems, avionics, and military communication equipment.Overall, the COMMPC8360E-10-2752FCR integrated circuit chips offer high performance, power efficiency, and integrated features, making them suitable for a wide range of applications in networking, industrial automation, embedded systems, communication, defense, and aerospace.
COMMPC8360E-10-2752FCR Relevant information