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CENGPXA270-312-10-550ECR

CENGPXA270-312-10-550ECR

Manufacturer No:

CENGPXA270-312-10-550ECR

Manufacturer:

Beacon EmbeddedWorks

Description:

IC MOD PXA270 312MHZ 64MB

Datasheet:

Datasheet

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CENGPXA270-312-10-550ECR Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    2.370" L x 2.670" W (60.20mm x 67.80mm)
  • Connector Type
    SO-DIMM-144
  • RAM Size
    64MB
  • Flash Size
    64MB
  • Speed
    312MHz
  • Co-Processor
    -
  • Core Processor
    PXA270
  • Module/Board Type
    MCU Core
  • Packaging
    Box
  • Product Status
    Obsolete
  • Series
    -
The CENGPXA270-312-10-550ECR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The CENGPXA270-312-10-550ECR chips are based on the ARM architecture and offer high processing power, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to be power-efficient, making them ideal for battery-powered devices or applications where power consumption is a concern. 3. Integrated Peripherals: The CENGPXA270-312-10-550ECR chips come with various integrated peripherals such as USB, Ethernet, UART, and GPIO, reducing the need for additional external components. 4. Wide Operating Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for industrial applications that require robust performance in harsh environments. 5. Longevity: The CENGPXA270-312-10-550ECR chips have a long product life cycle, ensuring availability and support for an extended period.Application Scenarios: 1. Embedded Systems: The CENGPXA270-312-10-550ECR chips are commonly used in embedded systems such as industrial automation, robotics, and control systems due to their high performance and low power consumption. 2. Handheld Devices: These chips can be found in handheld devices like PDAs, portable data loggers, and handheld terminals, where their power efficiency and integrated peripherals are advantageous. 3. Automotive Electronics: The CENGPXA270-312-10-550ECR chips can be used in automotive applications such as infotainment systems, telematics, and vehicle diagnostics due to their robustness and wide operating temperature range. 4. Medical Devices: These chips are suitable for medical devices like patient monitoring systems, portable medical instruments, and diagnostic equipment, where reliability and power efficiency are critical. 5. Communication Systems: The CENGPXA270-312-10-550ECR chips can be utilized in communication systems such as routers, gateways, and network appliances, thanks to their processing power and integrated networking capabilities.Overall, the CENGPXA270-312-10-550ECR integrated circuit chips offer a combination of high performance, low power consumption, and integrated peripherals, making them suitable for a wide range of applications in various industries.
CENGPXA270-312-10-550ECR Relevant information