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CENGPXA270-520-10-550HCR

CENGPXA270-520-10-550HCR

Manufacturer No:

CENGPXA270-520-10-550HCR

Manufacturer:

Beacon EmbeddedWorks

Description:

IC MOD PXA270 520MHZ 64MB

Datasheet:

Datasheet

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CENGPXA270-520-10-550HCR Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    2.370" L x 2.670" W (60.20mm x 67.80mm)
  • Connector Type
    SO-DIMM-144
  • RAM Size
    64MB
  • Flash Size
    32MB
  • Speed
    520MHz
  • Co-Processor
    -
  • Core Processor
    PXA270
  • Module/Board Type
    MCU Core
  • Packaging
    -
  • Product Status
    Obsolete
  • Series
    -
The CENGPXA270-520-10-550HCR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The CENGPXA270-520-10-550HCR chips are based on the ARM architecture and offer high processing power, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate efficiently with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Peripherals: The chips come with various integrated peripherals such as USB, Ethernet, UART, I2C, SPI, etc., reducing the need for additional external components and simplifying the overall system design. 4. Rich Software Ecosystem: The CENGPXA270-520-10-550HCR chips are supported by a wide range of software development tools, libraries, and operating systems, enabling developers to quickly build and deploy applications. 5. Industrial-Grade Reliability: These chips are designed to meet industrial-grade standards, ensuring high reliability and durability in harsh environments.Application Scenarios: 1. Embedded Systems: The CENGPXA270-520-10-550HCR chips are commonly used in embedded systems such as industrial automation, robotics, smart appliances, and IoT devices, where high performance and low power consumption are essential. 2. Handheld Devices: Due to their low power consumption and integrated peripherals, these chips are suitable for handheld devices like portable data terminals, barcode scanners, handheld gaming consoles, etc. 3. Communication Equipment: The CENGPXA270-520-10-550HCR chips can be used in networking equipment, routers, gateways, and other communication devices that require high processing power and connectivity options. 4. Automotive Applications: These chips find applications in automotive systems like infotainment systems, telematics, and advanced driver-assistance systems (ADAS), where reliability, performance, and power efficiency are crucial. 5. Medical Devices: The CENGPXA270-520-10-550HCR chips can be utilized in medical devices such as patient monitoring systems, portable diagnostic equipment, and medical imaging devices, where real-time processing and low power consumption are vital.Overall, the CENGPXA270-520-10-550HCR integrated circuit chips offer a combination of high performance, low power consumption, and integrated peripherals, making them suitable for a wide range of applications in various industries.
CENGPXA270-520-10-550HCR Relevant information