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CENGPXA270-312-10-550EC

CENGPXA270-312-10-550EC

Manufacturer No:

CENGPXA270-312-10-550EC

Manufacturer:

Beacon EmbeddedWorks

Description:

IC MOD PXA270 312MHZ 64MB

Datasheet:

Datasheet

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CENGPXA270-312-10-550EC Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 70°C
  • Size / Dimension
    2.370" L x 2.670" W (60.20mm x 67.80mm)
  • Connector Type
    SO-DIMM-144
  • RAM Size
    64MB
  • Flash Size
    64MB
  • Speed
    312MHz
  • Co-Processor
    -
  • Core Processor
    PXA270
  • Module/Board Type
    MCU Core
  • Packaging
    -
  • Product Status
    Obsolete
  • Series
    -
The CENGPXA270-312-10-550EC integrated circuit (IC) chip is a specific model of the PXA270 series developed by Intel. It is primarily used in embedded systems and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The CENGPXA270-312-10-550EC chip is based on the Intel XScale microarchitecture, which provides high processing power and performance efficiency. 2. Low Power Consumption: It is designed to operate at low power levels, making it suitable for battery-powered devices and energy-efficient applications. 3. Integrated Peripherals: The chip includes various integrated peripherals such as USB, Ethernet, UART, I2C, SPI, and GPIO, reducing the need for additional external components. 4. Rich Software Ecosystem: The CENGPXA270-312-10-550EC chip is supported by a wide range of software development tools, operating systems, and libraries, enabling developers to easily build applications. 5. Industrial-Grade Reliability: It is designed to meet industrial-grade standards, ensuring reliability and durability in harsh environments.Application Scenarios: 1. Embedded Systems: The CENGPXA270-312-10-550EC chip is commonly used in embedded systems such as industrial automation, robotics, smart appliances, and automotive applications. 2. Handheld Devices: Its low power consumption and high performance make it suitable for handheld devices like smartphones, tablets, PDAs, and portable media players. 3. Internet of Things (IoT): The chip's integrated peripherals and low power characteristics make it ideal for IoT devices, including smart home automation, wearable devices, and sensor nodes. 4. Medical Devices: The CENGPXA270-312-10-550EC chip can be utilized in medical devices like patient monitoring systems, portable diagnostic tools, and medical imaging equipment. 5. Communication Systems: It can be used in communication systems such as routers, gateways, and network switches, thanks to its networking capabilities and processing power.Overall, the CENGPXA270-312-10-550EC chip offers a balance between performance, power efficiency, and integration, making it suitable for a wide range of embedded applications.
CENGPXA270-312-10-550EC Relevant information