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CC-MX-MB6B-SLB-1

CC-MX-MB6B-SLB-1

Manufacturer No:

CC-MX-MB6B-SLB-1

Manufacturer:

Digi

Description:

IC MODULE CORTEX-A8

Datasheet:

Datasheet

Delivery:

Payment:

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CC-MX-MB6B-SLB-1 Specifications

  • Type
    Parameter
  • Operating Temperature
    -
  • Size / Dimension
    1.970" L x 3.230" W (50.00mm x 82.00mm)
  • Connector Type
    Board-to-Board (BTB) Socket - 360
  • RAM Size
    -
  • Flash Size
    -
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    ARM® Cortex®-A8, i.MX53
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    ConnectCore®
The CC-MX-MB6B-SLB-1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance and efficiency in various applications. 2. Low Power Consumption: They are optimized for low power consumption, making them suitable for battery-powered devices. 3. Compact Size: The chips are compact in size, allowing for easy integration into small form factor devices. 4. Wireless Connectivity: They support wireless connectivity standards like Bluetooth and Wi-Fi, enabling seamless communication with other devices. 5. Security Features: These chips come with built-in security features to ensure data privacy and protection against unauthorized access. 6. Scalability: They offer scalability options, allowing for easy customization and integration into different applications.Application Scenarios: 1. Internet of Things (IoT): The CC-MX-MB6B-SLB-1 chips can be used in IoT devices like smart home appliances, wearables, and industrial sensors to enable wireless connectivity and data transfer. 2. Home Automation: They can be utilized in home automation systems to control and monitor various devices remotely. 3. Healthcare: These chips can be integrated into medical devices and wearables to enable wireless data transmission and remote monitoring of patients. 4. Industrial Automation: They can be used in industrial automation systems to enable wireless communication between different components and devices. 5. Smart Grids: The chips can be employed in smart grid systems to enable communication between power generation, distribution, and consumption devices. 6. Automotive: They can be used in automotive applications like connected cars, telematics, and vehicle-to-vehicle communication systems.Overall, the CC-MX-MB6B-SLB-1 integrated circuit chips offer high performance, low power consumption, and wireless connectivity, making them suitable for a wide range of applications in IoT, home automation, healthcare, industrial automation, smart grids, and automotive sectors.
CC-MX-MB6B-SLB-1 Relevant information