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TE0745-02-93E31-A

TE0745-02-93E31-A

Manufacturer No:

TE0745-02-93E31-A

Manufacturer:

Trenz Electronic GmbH

Description:

MOD SOM DDR3L 1GB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0745-02-93E31-A Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    Board-to-Board (BTB) Socket - 480
  • RAM Size
    1GB
  • Flash Size
    64MB
  • Speed
    -
  • Co-Processor
    Zynq-7000 (Z-7045)
  • Core Processor
    ARM Cortex-A9
  • Module/Board Type
    MCU, FPGA
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0745
The TE0745-02-93E31-A integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips are designed to deliver high performance with low power consumption, making them suitable for demanding applications. 2. Versatility: They can be used in a wide range of applications due to their flexible architecture and programmability. 3. Integration: The chips integrate multiple functions and peripherals, reducing the need for additional components and simplifying the overall system design. 4. Scalability: They offer scalability options, allowing for easy customization and adaptation to different requirements. 5. Reliability: These chips are designed to be highly reliable, ensuring stable operation even in harsh environments.Application Scenarios: 1. Industrial Automation: The TE0745-02-93E31-A chips can be used in industrial automation systems for tasks such as control, monitoring, and data acquisition. 2. Robotics: They are suitable for robotics applications, providing the necessary processing power and connectivity for robot control and perception. 3. Internet of Things (IoT): These chips can be used in IoT devices for data processing, communication, and connectivity with other devices. 4. Medical Devices: They find application in medical devices such as patient monitoring systems, medical imaging, and diagnostic equipment. 5. Automotive: The chips can be used in automotive applications for tasks like engine control, driver assistance systems, and infotainment systems. 6. Aerospace and Defense: They are suitable for aerospace and defense applications, including avionics, radar systems, and communication equipment.These are just a few examples, and the TE0745-02-93E31-A chips can be used in various other scenarios where high-performance processing and integration are required.
TE0745-02-93E31-A Relevant information