TE0745-02-92I31-F
Manufacturer No:
TE0745-02-92I31-F
Manufacturer:
Description:
MOD SOM DDR3L 1GB
Datasheet:
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In Stock : 0
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TE0745-02-92I31-F Specifications
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TypeParameter
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Operating Temperature-40°C ~ 85°C
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Size / Dimension2.050" L x 2.990" W (52.00mm x 76.00mm)
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Connector TypeBoard-to-Board (BTB) Socket - 480
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RAM Size1GB
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Flash Size64MB
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Speed-
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Co-ProcessorZynq-7000 (Z-7045)
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Core ProcessorARM Cortex-A9
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Module/Board TypeMCU, FPGA
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PackagingBulk
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Product StatusActive
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SeriesTE0745
The TE0745-02-92I31-F is a specific integrated circuit (IC) chip, and without more information about its specific features and capabilities, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for IC chips:Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Power efficiency: IC chips are designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Performance: IC chips can offer high-speed processing, improved signal quality, and advanced functionality compared to discrete components.Application scenarios for IC chips: 1. Consumer electronics: IC chips are widely used in smartphones, tablets, laptops, televisions, and other consumer electronic devices to provide various functionalities like processing, memory, wireless communication, and audio/video processing. 2. Automotive: IC chips are used in automotive applications for engine control, safety systems, infotainment, navigation, and driver assistance systems. 3. Industrial automation: IC chips are employed in industrial automation systems for control, monitoring, and communication purposes. 4. Internet of Things (IoT): IC chips play a crucial role in IoT devices, enabling connectivity, data processing, and sensor integration. 5. Medical devices: IC chips are used in medical devices for diagnostics, monitoring, imaging, and treatment purposes. 6. Aerospace and defense: IC chips are utilized in aerospace and defense applications for communication, navigation, radar systems, and control systems.It is important to note that the specific advantages and application scenarios of the TE0745-02-92I31-F chip may vary depending on its specific features, specifications, and intended use.
TE0745-02-92I31-F Relevant information
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