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TE0803-04-5DI21-A

TE0803-04-5DI21-A

Manufacturer No:

TE0803-04-5DI21-A

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

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TE0803-04-5DI21-A Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    4GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU5EV-1SFVC784I
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0803
The TE0803-04-5DI21-A is an integrated circuit chip developed by Trenz Electronic. It is a highly versatile and powerful chip that offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TE0803-04-5DI21-A chip are:Advantages: 1. High Performance: The TE0803-04-5DI21-A chip is based on the Xilinx Zynq UltraScale+ MPSoC, which combines a high-performance ARM processor with programmable logic. This allows for efficient processing and high-speed data transfer.2. Programmability: The chip's programmable logic allows for customization and flexibility. It can be programmed to perform specific tasks and adapt to different application requirements.3. Integration: The TE0803-04-5DI21-A chip integrates multiple components, including the ARM processor, programmable logic, memory, and various peripherals. This integration reduces the need for external components and simplifies the overall system design.4. Connectivity: The chip supports various communication interfaces such as Ethernet, USB, PCIe, and CAN. This enables seamless connectivity with other devices and systems.5. Real-Time Processing: The TE0803-04-5DI21-A chip is capable of real-time processing, making it suitable for applications that require low-latency and high-speed data processing.Application Scenarios: 1. Embedded Systems: The TE0803-04-5DI21-A chip can be used in embedded systems where high-performance processing and programmability are required. It can be used in applications such as industrial automation, robotics, and automotive systems.2. High-Speed Data Processing: The chip's high-performance capabilities make it suitable for applications that involve high-speed data processing, such as image and video processing, signal processing, and data analytics.3. Communication Systems: The TE0803-04-5DI21-A chip's connectivity options make it suitable for communication systems, including network routers, switches, and gateways. It can handle data routing, protocol conversion, and other communication-related tasks.4. Test and Measurement: The chip's programmability and real-time processing capabilities make it suitable for test and measurement applications. It can be used in instruments such as oscilloscopes, spectrum analyzers, and data loggers.5. Aerospace and Defense: The TE0803-04-5DI21-A chip's high-performance processing and integration make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, communication systems, and other mission-critical applications.Overall, the TE0803-04-5DI21-A chip offers a wide range of advantages and can be applied in various scenarios that require high-performance processing, programmability, and connectivity.
TE0803-04-5DI21-A Relevant information