TE0803-04-5DE11-A

TE0803-04-5DE11-A

Manufacturer No:

TE0803-04-5DE11-A

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0803-04-5DE11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU5EV-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0803
The TE0803-04-5DE11-A is an integrated circuit chip developed by Trenz Electronic. It belongs to the TE0803 series and is specifically designed for high-performance applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The TE0803-04-5DE11-A chip is built with a Xilinx Zynq UltraScale+ MPSoC, which combines a powerful Arm Cortex-A53 processor with programmable logic. This allows for high-performance computing and flexibility in implementing custom functions. 2. Versatility: The chip supports a wide range of interfaces, including PCIe, USB, Ethernet, HDMI, and more. This makes it suitable for various applications that require connectivity and data transfer. 3. FPGA Flexibility: With the programmable logic of the FPGA, users can implement custom hardware accelerators, digital signal processing algorithms, or any other functionality required for their specific application. 4. Scalability: The TE0803-04-5DE11-A chip is designed to be used on a carrier board, which provides additional expansion options. This allows for scalability and customization based on the specific requirements of the application.Application Scenarios: 1. High-Performance Computing: The TE0803-04-5DE11-A chip is suitable for applications that require high computational power, such as data analytics, machine learning, and image processing. 2. Embedded Systems: With its combination of a processor and FPGA, this chip is ideal for embedded systems that require real-time processing, high-speed data acquisition, or custom hardware acceleration. 3. Communication Systems: The chip's support for various interfaces makes it suitable for communication systems, including network routers, software-defined radios, and industrial control systems. 4. Test and Measurement: The TE0803-04-5DE11-A chip can be used in test and measurement equipment, providing high-speed data acquisition, signal processing, and control capabilities.Overall, the TE0803-04-5DE11-A chip offers high performance, versatility, and scalability, making it suitable for a wide range of applications that require both processing power and flexibility in hardware implementation.