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TE0803-04-4DE11-A

TE0803-04-4DE11-A

Manufacturer No:

TE0803-04-4DE11-A

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

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TE0803-04-4DE11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0803
The TE0803-04-4DE11-A is an integrated circuit chip developed by Trenz Electronic. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The TE0803-04-4DE11-A chip is based on the Xilinx Zynq UltraScale+ MPSoC, which combines a high-performance ARM processor with programmable logic. This allows for the execution of complex tasks and the implementation of custom hardware accelerators.2. Programmability: The chip's programmable logic enables users to implement custom functionality and adapt the chip to specific application requirements. This flexibility is particularly useful in scenarios where the workload or functionality may change over time.3. System Integration: The TE0803-04-4DE11-A chip integrates multiple components, including the ARM processor, programmable logic, memory interfaces, and various peripherals. This integration simplifies system design and reduces the number of external components required.4. Power Efficiency: The chip incorporates power management features that optimize power consumption based on the workload. This makes it suitable for applications where power efficiency is crucial, such as portable devices or battery-powered systems.Application Scenarios: 1. Embedded Systems: The TE0803-04-4DE11-A chip is well-suited for embedded systems that require a combination of high-performance processing and custom hardware acceleration. It can be used in applications such as industrial automation, robotics, and automotive systems.2. High-Performance Computing: The chip's programmable logic and high-performance ARM processor make it suitable for applications that require significant computational power. It can be used in areas like data centers, scientific research, and signal processing.3. Internet of Things (IoT): The TE0803-04-4DE11-A chip's power efficiency and integration make it suitable for IoT applications. It can be used in edge devices that require both processing capabilities and connectivity to the cloud or other devices.4. Prototyping and Development: The chip's programmability and flexibility make it ideal for prototyping and development purposes. It allows engineers to quickly iterate and test different designs before moving to production.Overall, the TE0803-04-4DE11-A chip offers a combination of high performance, programmability, and integration, making it suitable for a wide range of applications in various industries.
TE0803-04-4DE11-A Relevant information