TE0803-02-03EG-1EB
Manufacturer No:
TE0803-02-03EG-1EB
Manufacturer:
Description:
IC MODULE ZYNQ USCALE 4GB 128MB
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
TE0803-02-03EG-1EB Specifications
-
TypeParameter
-
Operating Temperature0°C ~ 85°C
-
Size / Dimension2.050" L x 2.990" W (52.00mm x 76.00mm)
-
Connector TypeB2B
-
RAM Size4GB
-
Flash Size128MB
-
Speed-
-
Co-Processor-
-
Core ProcessorZynq UltraScale+ XCZU3EG-1SFVC784E
-
Module/Board TypeMPU Core
-
PackagingBulk
-
Product StatusActive
-
SeriesTE0803
The TE0803-02-03EG-1EB is a specific model of an integrated circuit chip, which is a programmable device that contains multiple electronic components on a single chip. While I couldn't find specific information about this particular model, I can provide you with general advantages and application scenarios of integrated circuit chips:Advantages of integrated circuit chips: 1. Miniaturization: Integrated circuit chips allow for the miniaturization of electronic components, enabling the creation of smaller and more compact devices. 2. Cost-effective: The mass production of integrated circuit chips reduces manufacturing costs, making them more affordable compared to discrete electronic components. 3. Reliability: Integrated circuit chips are less prone to failure due to their compact design and reduced number of interconnections. 4. Power efficiency: Integrated circuit chips are designed to be power-efficient, helping to conserve energy and extend battery life in portable devices. 5. Versatility: These chips can be programmed and reprogrammed, allowing for flexibility and adaptability in various applications.Application scenarios of integrated circuit chips: 1. Consumer electronics: Integrated circuit chips are widely used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive industry: They are used in various automotive systems, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: Integrated circuit chips are employed in industrial control systems, robotics, and process automation to enhance efficiency and productivity. 4. Medical devices: They are utilized in medical equipment such as pacemakers, MRI machines, and patient monitoring systems. 5. Internet of Things (IoT): Integrated circuit chips play a crucial role in IoT devices, enabling connectivity and data processing in smart homes, wearables, and industrial IoT applications.It's important to note that the specific advantages and application scenarios of the TE0803-02-03EG-1EB chip may vary depending on its intended purpose and specifications.
TE0803-02-03EG-1EB Relevant information
-
ME-AA1-480-1E2-D12E-R2
Enclustra FPGA Solutions -
ME-AA1-270-2I2-D11E-R2
Enclustra FPGA Solutions -
AA1-480-2I3-D12E-NFX3-R2
Enclustra FPGA Solutions -
ME-XU7-6EG-1I-D11E-R5.0
Enclustra FPGA Solutions -
ME-XU7-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU7-15EG-2I-D12E-R5.0
Enclustra FPGA Solutions -
ME-XU9-5EV-1I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU9-4CG-1E-D11E-R3.0
Enclustra FPGA Solutions -
ME-XU9-7EV-2I-D12E-L11-R3.0
Enclustra FPGA Solutions -
ME-XU1-9EG-2I-D12E-R5.0
Enclustra FPGA Solutions