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TE0803-04-3AE11-A

TE0803-04-3AE11-A

Manufacturer No:

TE0803-04-3AE11-A

Manufacturer:

Trenz Electronic GmbH

Description:

IC MODULE ZYNQ USCALE 2GB 128MB

Datasheet:

Datasheet

Delivery:

Payment:

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TE0803-04-3AE11-A Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Connector Type
    B2B
  • RAM Size
    2GB
  • Flash Size
    128MB
  • Speed
    -
  • Co-Processor
    -
  • Core Processor
    Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Module/Board Type
    MPU Core
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TE0803
The TE0803-04-3AE11-A is a specific model of an integrated circuit chip, which is a general term for a small electronic device that contains multiple electronic components such as transistors, resistors, and capacitors on a single semiconductor substrate. Advantages of TE0803-04-3AE11-A integrated circuit chips: 1. High integration: Integrated circuit chips can pack a large number of electronic components into a small space, leading to compact and lightweight designs. 2. Low power consumption: These chips are designed to operate efficiently with minimal power requirements, making them suitable for battery-powered devices. 3. High reliability: Integrated circuit chips are manufactured using advanced processes, ensuring high-quality and reliable performance. 4. Cost-effective: Mass production of integrated circuit chips reduces the overall cost per unit, making them affordable for various applications.Application scenarios of TE0803-04-3AE11-A integrated circuit chips: 1. Embedded systems: These chips are commonly used in embedded systems, such as industrial control systems, automotive electronics, and consumer electronics, to provide processing power and control functions. 2. Communication devices: Integrated circuit chips are used in various communication devices like routers, modems, and network switches to handle data processing and transmission. 3. Medical devices: Integrated circuit chips are utilized in medical devices like pacemakers, blood pressure monitors, and diagnostic equipment to perform complex calculations and control functions. 4. Internet of Things (IoT): With their small size and low power consumption, integrated circuit chips are ideal for IoT devices, enabling connectivity and smart functionality in various applications like home automation, environmental monitoring, and wearable devices. 5. Aerospace and defense: Integrated circuit chips are used in aerospace and defense applications, including satellites, radar systems, and missile guidance systems, where reliability and performance are critical.It's important to note that the specific advantages and application scenarios of the TE0803-04-3AE11-A chip may vary depending on its specific features and capabilities.
TE0803-04-3AE11-A Relevant information