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OSD32MP157F-512M-BAA

OSD32MP157F-512M-BAA

Manufacturer No:

OSD32MP157F-512M-BAA

Manufacturer:

Octavo Systems LLC

Description:

SIP: 157F, 512MB, BAA

Datasheet:

Datasheet

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OSD32MP157F-512M-BAA Specifications

  • Type
    Parameter
  • Operating Temperature
    0°C ~ 85°C
  • Size / Dimension
    0.710" L x 0.710" W (18.00mm x 18.00mm)
  • Connector Type
    302-BGA
  • RAM Size
    512MB
  • Flash Size
    -
  • Speed
    800MHz
  • Co-Processor
    NEON™ SIMD
  • Core Processor
    Arm® Dual Cortex®-A7, Arm® Cortex®-M4
  • Module/Board Type
    MPU Core
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The OSD32MP157F-512M-BAA is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High Performance: The OSD32MP157F-512M-BAA chip is based on the Arm Cortex-A7 architecture, which provides high processing power and performance for demanding applications. 2. Low Power Consumption: This chip is designed to be power-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 3. Integrated Graphics Processing Unit (GPU): The chip includes a 3D graphics processing unit, which enables the development of applications that require graphical rendering or acceleration. 4. Rich Connectivity Options: The OSD32MP157F-512M-BAA chip offers various connectivity options, including Ethernet, USB, CAN, SPI, I2C, and UART, making it suitable for applications that require communication with other devices or networks. 5. Robust Security Features: The chip includes hardware security features like secure boot, secure storage, and cryptographic accelerators, ensuring the protection of sensitive data and secure booting of the system.Application Scenarios: 1. Industrial Automation: The high performance and connectivity options of the OSD32MP157F-512M-BAA chip make it suitable for industrial automation applications, such as programmable logic controllers (PLCs), human-machine interfaces (HMIs), or industrial gateways. 2. Internet of Things (IoT): With its low power consumption and rich connectivity options, this chip can be used in IoT devices, such as smart home devices, wearables, or environmental sensors. 3. Multimedia Applications: The integrated GPU and high processing power of the chip make it suitable for multimedia applications, including digital signage, media players, or video surveillance systems. 4. Edge Computing: The OSD32MP157F-512M-BAA chip can be used in edge computing scenarios, where processing power and connectivity are required at the edge of the network, enabling real-time data processing and decision-making. 5. Automotive: The chip's robust security features and connectivity options make it suitable for automotive applications, such as infotainment systems, telematics, or advanced driver-assistance systems (ADAS).Overall, the OSD32MP157F-512M-BAA chip offers a combination of high performance, low power consumption, rich connectivity options, and security features, making it suitable for a wide range of applications in various industries.
OSD32MP157F-512M-BAA Relevant information