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MSC8156EAG1000B

MSC8156EAG1000B

Manufacturer No:

MSC8156EAG1000B

Manufacturer:

NXP USA Inc.

Description:

IC DGTL SIGNAL PROCESSOR BGA783

Datasheet:

Datasheet

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MSC8156EAG1000B Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 105°C
  • Voltage - Core
    1.00V
  • Voltage - I/O
    2.50V
  • On-Chip RAM
    576kB
  • Non-Volatile Memory
    ROM (96kB)
  • Clock Rate
    1GHz
  • Interface
    Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Type
    SC3850 Six Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The MSC8156EAG1000B is a highly integrated digital signal processor (DSP) chip developed by NXP Semiconductors. It is specifically designed for high-performance applications in the wireless infrastructure market. Here are some advantages and application scenarios of the MSC8156EAG1000B:Advantages: 1. High Performance: The chip is based on the StarCore SC3850 DSP core, which provides high processing power and performance for demanding applications. 2. Integration: It integrates multiple processing cores, accelerators, and peripherals on a single chip, reducing the need for external components and simplifying system design. 3. Power Efficiency: The chip is designed to deliver high performance while minimizing power consumption, making it suitable for power-constrained applications. 4. Scalability: The chip supports scalability, allowing for easy integration into different system configurations and future upgrades. 5. Flexibility: It offers a wide range of interfaces and connectivity options, enabling seamless integration with other system components.Application Scenarios: 1. Wireless Base Stations: The MSC8156EAG1000B is commonly used in wireless base stations for various cellular technologies, including 4G LTE, 5G, and Wi-Fi. It provides the processing power and flexibility required for baseband processing, beamforming, and other advanced features. 2. Small Cells: The chip is suitable for small cell deployments, where compact size and low power consumption are crucial. It enables efficient processing of wireless signals in small form factor base stations. 3. Distributed Antenna Systems (DAS): DAS solutions require high-performance signal processing to distribute wireless signals across large areas. The MSC8156EAG1000B can handle the complex signal processing tasks involved in DAS deployments. 4. Wireless Backhaul: The chip can be used in wireless backhaul systems to process and transmit data between base stations and the core network. It enables high-speed data processing and efficient connectivity options. 5. Software-Defined Radio (SDR): The MSC8156EAG1000B's flexibility and programmability make it suitable for SDR applications, where the radio functionality can be defined and updated through software.Overall, the MSC8156EAG1000B offers high performance, integration, and flexibility, making it a suitable choice for various wireless infrastructure applications.
MSC8156EAG1000B Relevant information