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66AK2H12BXAAW2

66AK2H12BXAAW2

Manufacturer No:

66AK2H12BXAAW2

Manufacturer:

Texas Instruments

Description:

IC DSP ARM SOC 1517FCBGA

Datasheet:

Datasheet

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66AK2H12BXAAW2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 85°C (TC)
  • Voltage - Core
    Variable
  • Voltage - I/O
    0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • On-Chip RAM
    12.75MB
  • Non-Volatile Memory
    ROM (384kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Type
    DSP+ARM®
  • Packaging
    Tray
  • Product Status
    Discontinued at Digi-Key
  • Series
    66AK2Hx KeyStone Multicore
The 66AK2H12BXAAW2 integrated circuit (IC) chips, also known as the Keystone II System-on-Chip (SoC) devices, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The 66AK2H12BXAAW2 chips are designed for high-performance applications, offering a combination of powerful processing capabilities and high-speed connectivity. 2. Multicore Architecture: These chips feature a multicore architecture with up to 12 ARM Cortex-A15 cores, providing parallel processing capabilities for demanding applications. 3. DSP Acceleration: The chips also include multiple TI C66x DSP cores, which are optimized for digital signal processing tasks, enabling efficient execution of complex algorithms. 4. Integrated Connectivity: They offer a wide range of integrated connectivity options, including Ethernet, PCIe, USB, SATA, and more, allowing seamless integration with various systems and peripherals. 5. Low Power Consumption: Despite their high-performance capabilities, the 66AK2H12BXAAW2 chips are designed to be power-efficient, making them suitable for applications where power consumption is a concern.Application Scenarios: 1. Communications Infrastructure: These chips are commonly used in communications infrastructure applications such as base stations, radio access networks, and small cells. Their high-performance processing and connectivity capabilities make them ideal for handling the demands of modern communication systems. 2. Industrial Automation: The 66AK2H12BXAAW2 chips find applications in industrial automation systems, where they can handle real-time control, data processing, and communication tasks. Their multicore architecture and DSP acceleration enable efficient execution of control algorithms and signal processing tasks. 3. Medical Imaging: With their powerful processing capabilities and DSP acceleration, these chips are suitable for medical imaging applications such as ultrasound, MRI, and CT scanners. They can handle the complex algorithms involved in image processing and analysis. 4. Aerospace and Defense: The 66AK2H12BXAAW2 chips are also used in aerospace and defense applications, including radar systems, electronic warfare, and avionics. Their high-performance processing and connectivity options enable real-time data processing and communication in these critical systems. 5. Video Surveillance: These chips can be utilized in video surveillance systems, where they can handle video encoding, decoding, and analytics tasks. Their multicore architecture and DSP acceleration enable efficient video processing and analysis.Overall, the 66AK2H12BXAAW2 chips offer high-performance processing, connectivity, and power efficiency, making them suitable for a wide range of applications in various industries.
66AK2H12BXAAW2 Relevant information