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66AK2H12BAAWA2

66AK2H12BAAWA2

Manufacturer No:

66AK2H12BAAWA2

Manufacturer:

Texas Instruments

Description:

IC DSP ARM SOC 1517FCBGA

Datasheet:

Datasheet

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66AK2H12BAAWA2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TC)
  • Voltage - Core
    Variable
  • Voltage - I/O
    0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • On-Chip RAM
    12.75MB
  • Non-Volatile Memory
    ROM (384kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Type
    DSP+ARM®
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    66AK2Hx KeyStone Multicore
The 66AK2H12BAAWA2 integrated circuit (IC) chips have several advantages and application scenarios. Some of them are:1. High Performance: These chips are designed for high-performance applications, offering a combination of digital signal processing (DSP) and ARM processing capabilities. They provide high processing power and can handle complex algorithms efficiently.2. Multicore Architecture: The chips feature a multicore architecture with up to 12 cores, allowing for parallel processing and improved performance. This makes them suitable for applications that require high computational power, such as video and audio processing, radar systems, and telecommunications.3. Flexible Software Support: The chips are supported by a comprehensive software development kit (SDK) and a range of development tools. This enables developers to easily program and optimize their applications for the specific requirements of the chip, reducing development time and effort.4. Connectivity Options: The chips offer various connectivity options, including Ethernet, PCIe, USB, and Serial RapidIO. This makes them suitable for applications that require high-speed data transfer and communication, such as networking equipment, industrial automation, and high-performance computing.5. Real-Time Processing: The chips are designed for real-time processing, making them suitable for applications that require low-latency and deterministic response, such as industrial control systems, robotics, and medical imaging.6. Power Efficiency: The chips are designed to be power-efficient, offering a balance between performance and power consumption. This makes them suitable for applications that require high processing power while maintaining low power consumption, such as portable devices and battery-powered systems.Application scenarios for the 66AK2H12BAAWA2 chips include:1. Wireless Infrastructure: These chips can be used in base stations and wireless access points for processing and managing high-speed data traffic in wireless networks.2. Video and Audio Processing: The chips can be used in video surveillance systems, video conferencing equipment, and audio processing applications, providing real-time video and audio encoding, decoding, and processing capabilities.3. Radar and Sonar Systems: The chips can be used in radar and sonar systems for signal processing, target detection, and tracking, providing high-performance and real-time processing capabilities.4. Telecommunications: The chips can be used in telecommunications equipment, such as routers and switches, for high-speed data processing and packet forwarding.5. Industrial Automation: The chips can be used in industrial automation systems for real-time control and monitoring, enabling efficient and reliable operation of manufacturing processes.6. Medical Imaging: The chips can be used in medical imaging equipment, such as ultrasound machines and MRI scanners, for real-time image processing and analysis.Overall, the 66AK2H12BAAWA2 chips offer high performance, flexibility, and power efficiency, making them suitable for a wide range of applications that require high computational power and real-time processing capabilities.
66AK2H12BAAWA2 Relevant information