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66AK2H12AAAWA2

66AK2H12AAAWA2

Manufacturer No:

66AK2H12AAAWA2

Manufacturer:

Texas Instruments

Description:

IC DSP ARM SOC 1517BGA

Datasheet:

Datasheet

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66AK2H12AAAWA2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TC)
  • Voltage - Core
    Variable
  • Voltage - I/O
    0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • On-Chip RAM
    12.75MB
  • Non-Volatile Memory
    ROM (384kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Type
    DSP+ARM®
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    66AK2Hx KeyStone Multicore
The 66AK2H12AAAWA2 integrated circuit (IC) chips, also known as the Keystone II System-on-Chip (SoC), have several advantages and application scenarios. Some of them include:1. High Performance: The 66AK2H12AAAWA2 chips are designed for high-performance applications, offering a combination of ARM Cortex-A15 cores and TI C66x DSP cores. This allows for efficient processing of complex algorithms and tasks.2. Multicore Processing: The chips feature multiple cores, including ARM and DSP cores, which enable parallel processing and improved performance for applications that require heavy computational tasks.3. Flexibility: The 66AK2H12AAAWA2 chips provide flexibility in terms of software development and programming. They support various operating systems and development tools, allowing developers to choose the most suitable environment for their applications.4. Connectivity: These chips offer a wide range of connectivity options, including Ethernet, PCIe, USB, and Serial RapidIO. This makes them suitable for applications that require high-speed data transfer and communication.5. Multimedia Processing: The integrated DSP cores in the 66AK2H12AAAWA2 chips are optimized for multimedia processing, making them ideal for applications such as video and audio processing, image recognition, and real-time analytics.6. Industrial Applications: The chips are designed to meet the requirements of industrial applications, including factory automation, robotics, and control systems. They offer real-time processing capabilities and support for industrial communication protocols.7. Wireless Infrastructure: The 66AK2H12AAAWA2 chips are suitable for wireless infrastructure applications, such as base stations and small cells. They provide high-performance processing and support for wireless protocols like LTE and 5G.8. Medical Imaging: The chips can be used in medical imaging applications, such as ultrasound and MRI machines, where real-time processing and high-performance computing are crucial for accurate diagnostics.9. Aerospace and Defense: The 66AK2H12AAAWA2 chips are also applicable in aerospace and defense systems, including radar processing, electronic warfare, and communication systems. They offer the required processing power and connectivity options for these demanding applications.Overall, the 66AK2H12AAAWA2 chips are versatile and powerful SoCs suitable for a wide range of applications that require high-performance processing, connectivity, and flexibility.
66AK2H12AAAWA2 Relevant information