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66AK2H06AXAAW2

66AK2H06AXAAW2

Manufacturer No:

66AK2H06AXAAW2

Manufacturer:

Texas Instruments

Description:

IC DSP ARM SOC 1517BGA

Datasheet:

Datasheet

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66AK2H06AXAAW2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 85°C (TC)
  • Voltage - Core
    Variable
  • Voltage - I/O
    0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • On-Chip RAM
    8.375MB
  • Non-Volatile Memory
    ROM (384kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Type
    DSP+ARM®
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    66AK2Hx KeyStone Multicore
The 66AK2H06AXAAW2 integrated circuit (IC) chips, also known as the Keystone II System-on-Chip (SoC) devices, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The 66AK2H06AXAAW2 chips are designed to deliver high-performance processing capabilities. They feature multiple ARM Cortex-A15 cores and C66x DSP cores, providing a powerful processing platform.2. Multicore Architecture: These chips have a multicore architecture, allowing for parallel processing and efficient utilization of resources. This makes them suitable for applications that require high computational power, such as multimedia processing, networking, and high-performance computing.3. Integrated Connectivity: The 66AK2H06AXAAW2 chips come with integrated connectivity options, including Ethernet, PCIe, USB, and Serial RapidIO interfaces. This enables seamless integration with various communication protocols and facilitates connectivity in networking and communication applications.4. Flexibility and Scalability: These chips offer flexibility and scalability, allowing developers to customize and optimize their applications. They support software-defined radio (SDR) and can be programmed to adapt to different use cases, making them suitable for a wide range of applications.Application Scenarios: 1. Wireless Infrastructure: The 66AK2H06AXAAW2 chips are commonly used in wireless infrastructure applications, such as base stations and small cells. Their high-performance processing capabilities and integrated connectivity options enable efficient data processing and communication in wireless networks.2. Media Processing: These chips are well-suited for media processing applications, including video transcoding, video analytics, and audio processing. The combination of ARM cores and DSP cores allows for efficient multimedia processing and real-time analytics.3. Industrial Automation: The 66AK2H06AXAAW2 chips find applications in industrial automation systems, such as programmable logic controllers (PLCs) and industrial gateways. Their high-performance processing and connectivity options enable real-time control and communication in industrial environments.4. Defense and Aerospace: These chips are also used in defense and aerospace applications, such as radar systems, electronic warfare, and satellite communication. The high computational power and flexibility of the 66AK2H06AXAAW2 chips make them suitable for demanding defense and aerospace requirements.Overall, the 66AK2H06AXAAW2 chips offer high performance, flexibility, and integrated connectivity, making them suitable for a wide range of applications that require advanced processing capabilities and efficient communication.
66AK2H06AXAAW2 Relevant information