Home / DSP (Digital Signal Processors) / MSC8156ESAG1000B/
MSC8156ESAG1000B

MSC8156ESAG1000B

Manufacturer No:

MSC8156ESAG1000B

Manufacturer:

NXP USA Inc.

Description:

IC DSP 6X 1GHZ SC3850 783FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MSC8156ESAG1000B Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 105°C (TJ)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    2.50V
  • On-Chip RAM
    576kB
  • Non-Volatile Memory
    ROM (96kB)
  • Clock Rate
    1GHz
  • Interface
    Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Type
    SC3850 Six Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The MSC8156ESAG1000B is a highly integrated digital signal processor (DSP) chip developed by NXP Semiconductors. It is specifically designed for high-performance applications in the wireless infrastructure market. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High Performance: The MSC8156ESAG1000B chip is based on the StarCore SC3850 DSP core, which offers exceptional processing power and performance. It can handle complex algorithms and data-intensive tasks efficiently.2. Multicore Architecture: The chip features six DSP cores, each capable of running at a clock speed of up to 1.2 GHz. The multicore architecture enables parallel processing, allowing for faster execution of tasks and improved overall system performance.3. Power Efficiency: The chip is designed to deliver high performance while maintaining power efficiency. It incorporates power management techniques to optimize power consumption, making it suitable for applications with strict power constraints.4. Integrated Peripherals: The MSC8156ESAG1000B chip integrates various peripherals, including Ethernet interfaces, serial interfaces, and memory controllers. This integration simplifies system design, reduces component count, and lowers overall system cost.Application Scenarios: 1. Wireless Base Stations: The MSC8156ESAG1000B chip is commonly used in wireless base stations for cellular networks. It can handle tasks such as signal processing, modulation/demodulation, and channel coding/decoding. The high performance and multicore architecture make it suitable for handling multiple simultaneous connections and high data rates.2. Radio Access Networks: The chip can be used in radio access network equipment, such as remote radio heads (RRHs) and distributed antenna systems (DAS). It can process and manage the wireless signals, enabling efficient communication between the base station and the end-user devices.3. Small Cell Networks: With the increasing demand for high-speed wireless connectivity in urban areas, small cell networks are becoming more prevalent. The MSC8156ESAG1000B chip can be used in small cell base stations to provide enhanced coverage and capacity in densely populated areas.4. Wireless Backhaul: The chip can also be utilized in wireless backhaul systems, which connect base stations to the core network. It can handle the processing and transmission of data between the base stations and the network, ensuring reliable and high-speed connectivity.Overall, the MSC8156ESAG1000B integrated circuit chip offers high performance, power efficiency, and integration, making it suitable for various wireless infrastructure applications.
MSC8156ESAG1000B Relevant information