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MSC8157ETVT1000A

MSC8157ETVT1000A

Manufacturer No:

MSC8157ETVT1000A

Manufacturer:

NXP USA Inc.

Description:

IC DSP 6-CORE DGTL 783FCBGA

Datasheet:

Datasheet

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MSC8157ETVT1000A Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    1.0V, 1.5V, 2.5V
  • On-Chip RAM
    6.375MB
  • Non-Volatile Memory
    ROM (96kB)
  • Clock Rate
    1GHz
  • Interface
    Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Type
    SC3850 Six Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The MSC8157ETVT1000A is a highly advanced integrated circuit chip designed by NXP Semiconductors. It belongs to the MSC8157E series of multicore digital signal processors (DSPs) and offers several advantages and application scenarios. Some of them are:1. High Performance: The MSC8157ETVT1000A chip is built with eight high-performance StarCore SC3850 DSP cores, each operating at up to 1.5 GHz. This enables it to deliver exceptional processing power for demanding applications.2. Multicore Architecture: The chip's multicore architecture allows for parallel processing, making it suitable for applications that require high computational capabilities, such as wireless base stations, media gateways, and video surveillance systems.3. Flexible Connectivity: The chip provides a wide range of connectivity options, including Gigabit Ethernet, PCI Express, Serial RapidIO, and Interlaken interfaces. This flexibility enables seamless integration with various communication systems and protocols.4. Advanced DSP Capabilities: The MSC8157ETVT1000A chip incorporates advanced DSP capabilities, including SIMD (Single Instruction, Multiple Data) instructions and floating-point arithmetic units. These features make it ideal for applications that involve complex mathematical calculations, such as audio and video processing.5. Low Power Consumption: Despite its high performance, the chip is designed to be power-efficient. It incorporates power management features that optimize power consumption, making it suitable for applications with strict power constraints, such as portable devices and battery-powered systems.6. Application Scenarios: The MSC8157ETVT1000A chip finds applications in various domains, including wireless infrastructure, aerospace and defense, industrial automation, and multimedia processing. It can be used in wireless base stations, software-defined radios, radar systems, high-performance computing, and multimedia transcoding, among others.Overall, the MSC8157ETVT1000A integrated circuit chip offers a combination of high performance, flexibility, and power efficiency, making it suitable for a wide range of demanding applications in different industries.
MSC8157ETVT1000A Relevant information