TMS320C6670CYPA2
Manufacturer No:
TMS320C6670CYPA2
Manufacturer:
Description:
IC DSP FIX/FLOAT POINT 841FCBGA
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TMS320C6670CYPA2 Specifications
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TypeParameter
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Supplier Device Package841-FCBGA (24x24)
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Package / Case841-BFBGA, FCBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 100°C (TC)
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Voltage - Core1.00V
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Voltage - I/O1.0V, 1.5V, 1.8V
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On-Chip RAM6.25MB
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Non-Volatile MemoryROM (128kB)
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Clock Rate1.2GHz
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InterfaceEBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
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TypeFixed/Floating Point
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PackagingTube
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Product StatusDiscontinued at Digi-Key
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SeriesTMS320C66x
The TMS320C6670CYPA2 is a high-performance digital signal processor (DSP) chip developed by Texas Instruments. It offers several advantages and can be applied in various scenarios:1. High processing power: The TMS320C6670CYPA2 is equipped with eight C66x DSP cores, each capable of running at 1.25 GHz. This high processing power makes it suitable for computationally intensive applications that require real-time processing, such as video and image processing, radar systems, and software-defined radio.2. Multicore architecture: The chip's multicore architecture allows for parallel processing, enabling efficient execution of complex algorithms and tasks. It supports inter-core communication and synchronization, making it ideal for applications that require distributed processing or multi-threading.3. Integrated peripherals: The TMS320C6670CYPA2 includes various integrated peripherals, such as Ethernet, PCIe, Serial RapidIO, and DDR3 memory interfaces. These peripherals simplify system integration and enable high-speed data transfer, making it suitable for networking, telecommunications, and high-performance computing applications.4. Scalability: The chip's architecture allows for scalability, enabling the use of multiple TMS320C6670CYPA2 chips in a system to achieve even higher processing power. This scalability makes it suitable for applications that require massive parallel processing, such as cloud computing, data centers, and high-performance computing clusters.5. Software development tools: Texas Instruments provides a comprehensive software development kit (SDK) and libraries for the TMS320C6670CYPA2, making it easier for developers to program and optimize their applications. The SDK includes tools for debugging, profiling, and performance analysis, facilitating efficient software development.Application scenarios for the TMS320C6670CYPA2 include:1. Wireless infrastructure: The chip's high processing power and integrated peripherals make it suitable for baseband processing in wireless communication systems, such as 4G/5G base stations. It can handle complex modulation schemes, channel coding, and beamforming algorithms.2. High-definition video processing: The TMS320C6670CYPA2's processing power and parallel architecture make it ideal for video processing applications, such as video transcoding, video analytics, and video conferencing. It can handle multiple video streams simultaneously and perform real-time video encoding and decoding.3. Radar and sonar systems: The chip's high-performance DSP cores and parallel processing capabilities make it suitable for radar and sonar signal processing. It can handle complex algorithms for target detection, tracking, and imaging, enabling high-resolution and real-time processing.4. Medical imaging: The TMS320C6670CYPA2 can be used in medical imaging systems, such as ultrasound and MRI machines, to process and analyze the acquired data. Its high processing power and parallel architecture enable real-time image reconstruction, enhancement, and analysis.5. High-performance computing: The chip's scalability and high processing power make it suitable for high-performance computing applications, such as scientific simulations, data analytics, and machine learning. Multiple TMS320C6670CYPA2 chips can be used in parallel to achieve massive computational power.
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