TMX320C6678CYP

TMX320C6678CYP

Manufacturer No:

TMX320C6678CYP

Manufacturer:

Texas Instruments

Description:

IC DSP FIX/FLOAT POINT 841FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TMX320C6678CYP Specifications

  • Type
    Parameter
  • Supplier Device Package
    841-FCBGA (24x24)
  • Package / Case
    841-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 85°C (TC)
  • Voltage - Core
    Variable
  • Voltage - I/O
    1.0V, 1.5V, 1.8V
  • On-Chip RAM
    8.5MB
  • Non-Volatile Memory
    ROM (128kB)
  • Clock Rate
    1GHz
  • Interface
    EBI/EMI, I²C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
  • Type
    Fixed/Floating Point
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    TMS320C66x
The TMX320C6678CYP is a high-performance multicore digital signal processor (DSP) chip developed by Texas Instruments. It offers several advantages and can be applied in various scenarios:1. High Performance: The TMX320C6678CYP chip features eight C66x DSP cores, each capable of running at 1.25 GHz. This high-performance architecture enables it to handle computationally intensive tasks efficiently.2. Multicore Processing: The chip's multicore architecture allows for parallel processing, enabling it to execute multiple tasks simultaneously. This makes it suitable for applications that require real-time processing of multiple data streams, such as video and audio processing, telecommunications, and radar systems.3. Low Power Consumption: Despite its high performance, the TMX320C6678CYP chip is designed to be power-efficient. It incorporates power management techniques to optimize power consumption, making it suitable for applications that require high processing power within strict power constraints.4. Scalability: The chip's architecture allows for scalability, enabling the use of multiple chips in a system to achieve even higher processing power. This scalability makes it suitable for applications that require massive parallel processing, such as high-performance computing, cloud computing, and data centers.5. Integrated Interfaces: The TMX320C6678CYP chip includes various integrated interfaces, such as Ethernet, PCIe, Serial RapidIO, and DDR3 memory controllers. These interfaces facilitate seamless connectivity with external devices and memory, making it suitable for applications that require high-speed data transfer and communication.Application scenarios for the TMX320C6678CYP chip include:1. 5G Wireless Infrastructure: The chip's high-performance DSP cores and integrated interfaces make it suitable for 5G base station applications, where it can handle the complex signal processing required for high-speed wireless communication.2. Video and Audio Processing: The chip's multicore architecture and high processing power make it ideal for video and audio processing applications, such as video transcoding, video conferencing, and audio effects processing.3. Radar and Sonar Systems: The chip's real-time processing capabilities and scalability make it suitable for radar and sonar systems, where it can handle the processing of multiple data streams simultaneously for target detection and tracking.4. High-Performance Computing: The chip's scalability and power-efficient design make it suitable for high-performance computing applications, such as scientific simulations, data analytics, and machine learning, where massive parallel processing is required.5. Cloud Computing and Data Centers: The chip's scalability and integrated interfaces make it suitable for cloud computing and data center applications, where it can handle the processing and communication requirements of large-scale data processing and storage systems.Overall, the TMX320C6678CYP chip offers high performance, power efficiency, and scalability, making it suitable for a wide range of applications that require real-time processing, parallel computing, and high-speed data transfer.