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KMC8144SVT1000B

KMC8144SVT1000B

Manufacturer No:

KMC8144SVT1000B

Manufacturer:

NXP USA Inc.

Description:

IC DSP 783FCBGA

Datasheet:

Datasheet

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KMC8144SVT1000B Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 105°C (TJ)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    10.5MB
  • Non-Volatile Memory
    ROM (96kB)
  • Clock Rate
    1GHz
  • Interface
    EBI/EMI, Ethernet, I²C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
  • Type
    SC3400 Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The KMC8144SVT1000B is a specific model of integrated circuit (IC) chip manufactured by NXP Semiconductors. It belongs to the PowerQUICC III family of communication processors. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The KMC8144SVT1000B chip is built on a Power Architecture core, providing high processing power and performance. 2. Integrated Features: It integrates various peripherals and interfaces like Ethernet, USB, UART, I2C, SPI, etc., reducing the need for additional external components. 3. Networking Capabilities: The chip supports various networking protocols like Ethernet, TCP/IP, UDP, etc., making it suitable for networking applications. 4. Security Features: It includes security features like encryption, authentication, and secure boot, ensuring data security in applications. 5. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications.Application Scenarios: 1. Networking Equipment: The KMC8144SVT1000B chip can be used in routers, switches, gateways, and other networking equipment due to its networking capabilities and high performance. 2. Industrial Automation: It can be utilized in industrial automation systems for tasks like data acquisition, control, and communication, thanks to its integrated features and robustness. 3. Internet of Things (IoT): The chip can be employed in IoT devices that require networking capabilities, processing power, and security features. 4. Embedded Systems: It can be used in various embedded systems, such as automotive electronics, smart appliances, and medical devices, where high performance and connectivity are required. 5. Communication Infrastructure: The chip can be utilized in communication infrastructure equipment like base stations, access points, and network switches due to its networking capabilities and performance.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the target system.
KMC8144SVT1000B Relevant information