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MSC8101M1375F

MSC8101M1375F

Manufacturer No:

MSC8101M1375F

Manufacturer:

NXP USA Inc.

Description:

DSP 16BIT 275MHZ CPM 332FCBGA

Datasheet:

Datasheet

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MSC8101M1375F Specifications

  • Type
    Parameter
  • Supplier Device Package
    332-FCBGA (17x17)
  • Package / Case
    332-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - Core
    1.60V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    512kB
  • Non-Volatile Memory
    External
  • Clock Rate
    275MHz
  • Interface
    Communications Processor Module (CPM)
  • Type
    SC140 Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The MSC8101M1375F is a specific model of integrated circuit (IC) chip manufactured by Freescale Semiconductor (now NXP Semiconductors). It belongs to the MSC8101 family of digital signal processors (DSPs). Here are some advantages and application scenarios of the MSC8101M1375F IC chip:Advantages: 1. High Performance: The MSC8101M1375F chip is designed for high-performance signal processing applications. It offers a powerful DSP core with a clock speed of up to 375 MHz, enabling efficient execution of complex algorithms and real-time processing.2. Integrated Peripherals: The chip includes various integrated peripherals, such as UART, SPI, I2C, timers, and general-purpose I/Os. These peripherals enhance the chip's versatility and enable easy interfacing with external devices.3. Low Power Consumption: The MSC8101M1375F chip is designed to operate at low power levels, making it suitable for battery-powered or energy-efficient applications. It incorporates power-saving features like multiple power management modes and dynamic voltage scaling.4. Scalability: The MSC8101M1375F chip is part of a scalable family of DSPs. This means that it can be used as a standalone processor or combined with other chips in the family to create more powerful and complex systems. This scalability allows for flexibility in designing systems with varying processing requirements.Application Scenarios: 1. Audio and Speech Processing: The high-performance DSP core of the MSC8101M1375F chip makes it suitable for audio and speech processing applications. It can be used in audio codecs, voice recognition systems, noise cancellation devices, and audio effects processors.2. Industrial Control Systems: The chip's integrated peripherals and processing capabilities make it suitable for industrial control systems. It can be used in applications like motor control, robotics, factory automation, and process control.3. Communication Systems: The MSC8101M1375F chip can be used in communication systems that require real-time signal processing. It can be utilized in wireless base stations, software-defined radios, digital modems, and telecommunication infrastructure.4. Medical Devices: The chip's high-performance processing and low power consumption make it suitable for medical devices. It can be used in applications like medical imaging, patient monitoring systems, digital signal analysis, and biomedical signal processing.5. Automotive Electronics: The MSC8101M1375F chip can be used in automotive electronics applications that require real-time processing and low power consumption. It can be utilized in systems like engine control units, advanced driver-assistance systems (ADAS), infotainment systems, and telematics.It's important to note that the specific application scenarios may vary depending on the system requirements and the overall design considerations.
MSC8101M1375F Relevant information