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SPAKDSP303VL100

SPAKDSP303VL100

Manufacturer No:

SPAKDSP303VL100

Manufacturer:

NXP USA Inc.

Description:

IC DSP 24BIT 100MHZ 196-MAPBGA

Datasheet:

Datasheet

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SPAKDSP303VL100 Specifications

  • Type
    Parameter
  • Supplier Device Package
    196-LBGA (15x15)
  • Package / Case
    196-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - Core
    3.30V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    24kB
  • Non-Volatile Memory
    ROM (576B)
  • Clock Rate
    100MHz
  • Interface
    Host Interface, SSI, SCI
  • Type
    Fixed Point
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    DSP563xx
The SPAKDSP303VL100 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPAKDSP303VL100 chips are designed to deliver high-performance digital signal processing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are designed to be compact, allowing for easy integration into small form factor devices. 4. Versatility: The SPAKDSP303VL100 chips support a wide range of applications, including audio and video processing, communications, image processing, and more. 5. Cost-Effective: These chips offer a cost-effective solution for implementing digital signal processing functionalities, making them suitable for mass production.Application Scenarios: 1. Audio and Video Processing: The SPAKDSP303VL100 chips can be used in audio and video processing applications, such as noise cancellation, audio enhancement, video encoding/decoding, and image recognition. 2. Communications: These chips can be utilized in communication systems, including wireless communication, voice over IP (VoIP), and digital signal modulation/demodulation. 3. Industrial Automation: The chips can be employed in industrial automation systems for tasks like sensor data processing, control algorithms, and machine vision. 4. Medical Devices: The SPAKDSP303VL100 chips can be used in medical devices for tasks like signal analysis, patient monitoring, and medical imaging. 5. Automotive: These chips can be integrated into automotive systems for applications like audio processing, advanced driver assistance systems (ADAS), and in-vehicle infotainment.Overall, the SPAKDSP303VL100 integrated circuit chips offer high-performance digital signal processing capabilities with low power consumption, making them suitable for a wide range of applications in various industries.
SPAKDSP303VL100 Relevant information