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MSC8101VT1375F

MSC8101VT1375F

Manufacturer No:

MSC8101VT1375F

Manufacturer:

NXP USA Inc.

Description:

IC DSP 16BIT 250MHZ 332FCBGA

Datasheet:

Datasheet

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MSC8101VT1375F Specifications

  • Type
    Parameter
  • Supplier Device Package
    332-FCBGA (17x17)
  • Package / Case
    332-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - Core
    1.60V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    512kB
  • Non-Volatile Memory
    External
  • Clock Rate
    275MHz
  • Interface
    Communications Processor Module (CPM)
  • Type
    SC140 Core
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    StarCore
The MSC8101VT1375F is a specific model of integrated circuit (IC) chip manufactured by Freescale Semiconductor (now NXP Semiconductors). It belongs to the MSC8101 family of digital signal processors (DSPs). While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and application scenarios of the MSC8101VT1375F IC chip:Advantages: 1. High-performance DSP: The MSC8101VT1375F is designed to deliver high-performance digital signal processing capabilities, making it suitable for demanding applications that require complex mathematical calculations and real-time processing.2. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications where energy efficiency is crucial, such as portable devices or battery-powered systems.3. Integrated peripherals: The MSC8101VT1375F integrates various peripherals, including timers, serial interfaces, general-purpose I/Os, and memory controllers. This integration simplifies system design and reduces the need for additional external components.4. Scalability: The MSC8101 family offers different models with varying performance levels, allowing designers to choose the appropriate chip based on their specific application requirements. This scalability enables flexibility and cost optimization.Application Scenarios: 1. Audio and speech processing: The high-performance DSP capabilities of the MSC8101VT1375F make it suitable for audio and speech processing applications. It can be used in audio codecs, noise cancellation systems, voice recognition, and synthesis applications.2. Telecommunications: The chip can be used in telecommunications systems for tasks such as voice compression, echo cancellation, and channel coding/decoding. It can also be used in wireless communication systems, including base stations and wireless infrastructure.3. Industrial automation: The MSC8101VT1375F can be utilized in industrial automation applications, such as motor control, robotics, and machine vision. Its real-time processing capabilities and integrated peripherals make it suitable for controlling and monitoring various industrial processes.4. Medical devices: The chip can be employed in medical devices that require real-time signal processing, such as patient monitoring systems, medical imaging, and diagnostic equipment.5. Automotive applications: The MSC8101VT1375F can be used in automotive systems, including advanced driver assistance systems (ADAS), infotainment systems, and engine control units (ECUs). Its high-performance DSP capabilities and low power consumption make it suitable for automotive applications.It's important to note that the specific advantages and application scenarios may vary depending on the system design, requirements, and the capabilities of the MSC8101VT1375F chip. It is recommended to consult the chip's datasheet and application notes for detailed information and guidance.
MSC8101VT1375F Relevant information