TMS320C6670AXCYP2

TMS320C6670AXCYP2

Manufacturer No:

TMS320C6670AXCYP2

Manufacturer:

Texas Instruments

Description:

IC DSP FIX/FLOAT POINT 841FCBGA

Datasheet:

Datasheet

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TMS320C6670AXCYP2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    841-FCBGA (24x24)
  • Package / Case
    841-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 100°C (TC)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    1.0V, 1.5V, 1.8V
  • On-Chip RAM
    6.25MB
  • Non-Volatile Memory
    ROM (128kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
  • Type
    Fixed/Floating Point
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    TMS320C66x
The TMS320C6670AXCYP2 is a high-performance digital signal processor (DSP) chip developed by Texas Instruments. It offers several advantages and can be applied in various scenarios:1. High Performance: The TMS320C6670AXCYP2 is designed to deliver high processing power with eight C66x DSP cores running at 1.25 GHz. This makes it suitable for computationally intensive applications that require real-time processing, such as video and image processing, radar systems, and software-defined radio.2. Multicore Architecture: The chip's multicore architecture allows for parallel processing, enabling efficient execution of complex algorithms and tasks. It supports inter-core communication and synchronization, making it suitable for applications that require distributed processing or multi-threading.3. Integrated Peripherals: The TMS320C6670AXCYP2 integrates various peripherals, including Ethernet, Serial RapidIO, and PCIe interfaces. These peripherals enable seamless connectivity with external devices and systems, making it suitable for networking applications, high-speed data transfer, and communication protocols.4. Scalability: The chip's architecture allows for scalability, enabling the use of multiple TMS320C6670AXCYP2 chips in a system. This scalability is beneficial for applications that require increased processing power or distributed processing across multiple DSPs.5. Software Development Tools: Texas Instruments provides a comprehensive software development kit (SDK) and libraries for the TMS320C6670AXCYP2. These tools simplify the development process and enable efficient programming, debugging, and optimization of DSP applications.Application Scenarios:1. Wireless Infrastructure: The TMS320C6670AXCYP2 is commonly used in wireless base stations and infrastructure equipment. Its high processing power and integrated peripherals make it suitable for tasks such as signal processing, modulation/demodulation, and protocol handling.2. Video and Image Processing: The chip's computational capabilities and parallel processing architecture make it ideal for video and image processing applications. It can be used in video surveillance systems, video transcoding, image recognition, and real-time video analytics.3. Aerospace and Defense: The TMS320C6670AXCYP2 is well-suited for aerospace and defense applications that require real-time processing and high-performance computing. It can be used in radar systems, sonar processing, software-defined radio, and electronic warfare systems.4. High-Performance Computing: The chip's multicore architecture and scalability make it suitable for high-performance computing applications. It can be used in supercomputers, data centers, and scientific simulations that require parallel processing and massive computational power.5. Industrial Automation: The TMS320C6670AXCYP2 can be applied in industrial automation systems that require real-time control, data processing, and communication. It can be used in robotics, machine vision, motion control, and process automation.Overall, the TMS320C6670AXCYP2 offers high performance, scalability, and integrated peripherals, making it suitable for a wide range of applications that require real-time processing, high computational power, and efficient parallel processing.