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BBN6203BGNY30C

BBN6203BGNY30C

Manufacturer No:

BBN6203BGNY30C

Manufacturer:

Texas Instruments

Description:

IC DSP FIXED POINT 384CSP

Datasheet:

Datasheet

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BBN6203BGNY30C Specifications

  • Type
    Parameter
  • Supplier Device Package
    384-FC/CSP (18x18)
  • Package / Case
    384-FBGA, FCCSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 90°C (TC)
  • Voltage - Core
    1.50V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    896kB
  • Non-Volatile Memory
    External
  • Clock Rate
    300MHz
  • Interface
    McBSP
  • Type
    Fixed Point
  • Packaging
    Tray
  • Product Status
    Not For New Designs
  • Series
    TMS320C62x
The BBN6203BGNY30C integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The BBN6203BGNY30C chips offer high-performance capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them energy-efficient. 3. Compact Size: The BBN6203BGNY30C chips are compact in size, allowing for easy integration into various electronic devices. 4. Wide Operating Temperature Range: These chips can operate in a wide temperature range, making them suitable for both indoor and outdoor applications. 5. Robustness: The BBN6203BGNY30C chips are designed to be robust and reliable, ensuring long-term operation in challenging environments.Application Scenarios: 1. Internet of Things (IoT): The BBN6203BGNY30C chips can be used in IoT devices, enabling connectivity and communication between various devices. 2. Industrial Automation: These chips can be utilized in industrial automation systems, providing control and monitoring capabilities. 3. Automotive Electronics: The BBN6203BGNY30C chips can be integrated into automotive electronics, enabling advanced features such as driver assistance systems and infotainment. 4. Consumer Electronics: These chips can be used in various consumer electronic devices, including smartphones, tablets, and smart home appliances. 5. Medical Devices: The BBN6203BGNY30C chips can be employed in medical devices, enabling data processing and communication for diagnostics and treatment.Overall, the BBN6203BGNY30C integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for a wide range of applications in different industries.
BBN6203BGNY30C Relevant information