66AK2G12ABY60

66AK2G12ABY60

Manufacturer No:

66AK2G12ABY60

Manufacturer:

Texas Instruments

Description:

GALILEO FLIPCHIP

Datasheet:

Datasheet

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66AK2G12ABY60 Specifications

  • Type
    Parameter
  • Supplier Device Package
    625-FCBGA (21x21)
  • Package / Case
    625-LFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 90°C (TJ)
  • Voltage - Core
    0.9V
  • Voltage - I/O
    1.8V, 3.3V
  • On-Chip RAM
    1MB
  • Non-Volatile Memory
    External
  • Clock Rate
    600MHz
  • Interface
    CAN, DMA, EBI/EMI, Ethernet, I²C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
  • Type
    DSP+ARM®
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    66AK2G1x KeyStone II Multicore
The 66AK2G12ABY60 is a highly integrated circuit chip designed by Texas Instruments. It is part of the KeyStone II architecture and is specifically designed for high-performance digital signal processing (DSP) applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 66AK2G12ABY60 chip offers high processing power with its dual-core ARM Cortex-A15 processors and eight C66x DSP cores. This allows for efficient and fast execution of complex algorithms and tasks. 2. Integration: It integrates multiple processing units, including DSP cores, ARM cores, and various peripherals, on a single chip. This reduces the need for external components and simplifies system design. 3. Flexibility: The chip supports a wide range of interfaces, including Ethernet, PCIe, USB, SATA, and more. This enables easy integration with various external devices and systems. 4. Power Efficiency: The chip is designed to optimize power consumption, making it suitable for applications with strict power constraints. 5. Scalability: The KeyStone II architecture allows for scalability, enabling the chip to be used in a variety of applications, from small embedded systems to high-performance computing.Application Scenarios: 1. Wireless Infrastructure: The 66AK2G12ABY60 chip can be used in base stations, small cells, and other wireless infrastructure equipment. Its high processing power and integration make it suitable for tasks like signal processing, modulation/demodulation, and protocol handling. 2. Industrial Automation: The chip can be used in industrial automation systems for tasks like real-time control, data acquisition, and signal processing. Its flexibility and scalability make it suitable for a wide range of applications in this field. 3. Medical Imaging: The chip's high-performance DSP cores and integration capabilities make it suitable for medical imaging applications like ultrasound, MRI, and CT scanners. It can handle complex image processing algorithms efficiently. 4. Video Surveillance: The chip can be used in video surveillance systems for tasks like video encoding/decoding, analytics, and network connectivity. Its high processing power and integration make it suitable for demanding surveillance applications. 5. Aerospace and Defense: The chip can be used in aerospace and defense applications, such as radar systems, communication systems, and electronic warfare. Its high-performance DSP cores and integration capabilities make it suitable for real-time signal processing and data handling.These are just a few examples of the advantages and application scenarios of the 66AK2G12ABY60 chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications in various industries.