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ADSP-BF705KBCZ-3

ADSP-BF705KBCZ-3

Manufacturer No:

ADSP-BF705KBCZ-3

Manufacturer:

Analog Devices Inc.

Description:

IC DSP LP 512KB L2SR 184BGA

Datasheet:

Datasheet

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ADSP-BF705KBCZ-3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    184-CSPBGA (12x12)
  • Package / Case
    184-LFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Core
    1.10V
  • Voltage - I/O
    1.8V, 3.3V
  • On-Chip RAM
    512kB
  • Non-Volatile Memory
    ROM (512kB)
  • Clock Rate
    300MHz
  • Interface
    CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
  • Type
    Blackfin+
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Blackfin®
The ADSP-BF705KBCZ-3 is a specific model of integrated circuit chip from Analog Devices. It belongs to the Blackfin family of processors and offers several advantages and application scenarios. Some of them include:1. High-performance processing: The ADSP-BF705KBCZ-3 chip is designed to deliver high-performance processing capabilities. It combines a dual-core processor with a rich set of peripherals, allowing for efficient execution of complex algorithms and real-time processing tasks.2. Low power consumption: This chip is optimized for low power consumption, making it suitable for battery-powered or energy-efficient applications. It offers power-saving features like dynamic voltage and frequency scaling, which help reduce power consumption without compromising performance.3. Real-time signal processing: The ADSP-BF705KBCZ-3 chip is particularly well-suited for real-time signal processing applications. It includes dedicated hardware accelerators for tasks like digital signal processing (DSP), audio processing, and image processing, enabling fast and efficient processing of real-time data.4. Connectivity options: The chip provides various connectivity options, including USB, UART, SPI, I2C, and GPIO, making it versatile for different application scenarios. It can easily interface with external devices, sensors, and communication modules, enabling seamless integration into a wide range of systems.5. Industrial and automotive applications: The ADSP-BF705KBCZ-3 chip is commonly used in industrial and automotive applications. Its robust processing capabilities, low power consumption, and real-time processing features make it suitable for applications like motor control, industrial automation, automotive infotainment systems, and advanced driver-assistance systems (ADAS).6. Internet of Things (IoT) devices: With its low power consumption and connectivity options, the chip is also well-suited for IoT devices. It can be used in applications like smart home automation, wearable devices, sensor networks, and edge computing, where efficient processing and connectivity are essential.Overall, the ADSP-BF705KBCZ-3 integrated circuit chip offers high-performance processing, low power consumption, real-time signal processing capabilities, and versatile connectivity options, making it suitable for a wide range of applications in industrial, automotive, and IoT domains.
ADSP-BF705KBCZ-3 Relevant information