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ADSP-BF702BCPZ-3

ADSP-BF702BCPZ-3

Manufacturer No:

ADSP-BF702BCPZ-3

Manufacturer:

Analog Devices Inc.

Description:

IC DSP LP 256KB L2SR 88LFCSP

Datasheet:

Datasheet

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ADSP-BF702BCPZ-3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    88-LFCSP-VQ (12x12)
  • Package / Case
    88-VFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Core
    1.10V
  • Voltage - I/O
    1.8V, 3.3V
  • On-Chip RAM
    256kB
  • Non-Volatile Memory
    ROM (512kB)
  • Clock Rate
    300MHz
  • Interface
    CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
  • Type
    Blackfin+
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Blackfin®
The ADSP-BF702BCPZ-3 is a specific integrated circuit (IC) chip from Analog Devices. It belongs to the Blackfin family of embedded processors and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High-performance processing: The ADSP-BF702BCPZ-3 chip provides a high-performance processing capability, making it suitable for applications that require complex algorithms and real-time processing.2. Dual-core architecture: It features a dual-core architecture with a general-purpose processor (GPP) and a digital signal processor (DSP). This allows for efficient execution of both control and signal processing tasks.3. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.4. Rich peripheral set: It offers a rich set of peripherals, including UART, SPI, I2C, timers, and GPIOs, enabling easy integration with various external devices and sensors.5. Extensive software ecosystem: Analog Devices provides a comprehensive software development environment, including compilers, debuggers, and libraries, which simplifies the development process and accelerates time-to-market.Application scenarios: 1. Audio and voice processing: The ADSP-BF702BCPZ-3 chip's DSP capabilities make it well-suited for audio and voice processing applications, such as noise cancellation, speech recognition, and audio effects.2. Industrial control systems: With its dual-core architecture and rich peripheral set, the chip can be used in industrial control systems for tasks like motor control, sensor interfacing, and data acquisition.3. Internet of Things (IoT) devices: The low power consumption and efficient processing make it suitable for IoT devices, such as smart sensors, wearables, and connected devices, where power efficiency and real-time processing are crucial.4. Automotive applications: The chip's high-performance processing and real-time capabilities make it suitable for automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units.5. Medical devices: The ADSP-BF702BCPZ-3 chip can be used in medical devices that require real-time signal processing, such as patient monitoring systems, medical imaging, and diagnostic equipment.These are just a few examples of the advantages and application scenarios of the ADSP-BF702BCPZ-3 chip. The versatility and capabilities of the chip make it suitable for a wide range of embedded processing applications.
ADSP-BF702BCPZ-3 Relevant information