ADSP-BF702KCPZ-3

ADSP-BF702KCPZ-3

Manufacturer No:

ADSP-BF702KCPZ-3

Manufacturer:

Analog Devices Inc.

Description:

IC DSP LP 256KB L2SR 88LFCSP

Datasheet:

Datasheet

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ADSP-BF702KCPZ-3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    88-LFCSP-VQ (12x12)
  • Package / Case
    88-VFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Core
    1.10V
  • Voltage - I/O
    1.8V, 3.3V
  • On-Chip RAM
    256kB
  • Non-Volatile Memory
    ROM (512kB)
  • Clock Rate
    300MHz
  • Interface
    CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
  • Type
    Blackfin+
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Blackfin®
The ADSP-BF702KCPZ-3 is a specific model of integrated circuit chip from Analog Devices. It belongs to the Blackfin family of processors and is designed for applications that require a combination of control and signal processing capabilities. Here are some advantages and application scenarios of the ADSP-BF702KCPZ-3:Advantages: 1. Dual-core architecture: The ADSP-BF702KCPZ-3 features a dual-core architecture with a control processor (Cortex-M3) and a signal processor (Blackfin DSP). This allows for efficient execution of both control and signal processing tasks in a single chip. 2. High-performance signal processing: The Blackfin DSP core provides high-performance signal processing capabilities, making it suitable for applications that require real-time processing of audio, video, or other types of signals. 3. Low power consumption: The ADSP-BF702KCPZ-3 is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 4. Rich peripheral set: The chip includes a rich set of peripherals such as UART, SPI, I2C, timers, and GPIOs, which enable easy interfacing with external devices and sensors.Application scenarios: 1. Audio and video processing: The ADSP-BF702KCPZ-3 can be used in applications that require real-time audio and video processing, such as audio codecs, video surveillance systems, or multimedia devices. 2. Industrial control systems: The dual-core architecture of the chip makes it suitable for industrial control systems that require both control and signal processing capabilities. It can be used in applications like motor control, robotics, or automation systems. 3. Internet of Things (IoT) devices: The low power consumption and rich peripheral set of the chip make it suitable for IoT devices that require both control and signal processing capabilities. It can be used in applications like smart home devices, wearable devices, or sensor nodes. 4. Medical devices: The high-performance signal processing capabilities of the chip make it suitable for medical devices that require real-time processing of biomedical signals, such as patient monitoring systems or medical imaging devices.These are just a few examples of the advantages and application scenarios of the ADSP-BF702KCPZ-3. The specific use cases may vary depending on the requirements of the application and the capabilities of the chip.