ADSP-SC573BBCZ-5

ADSP-SC573BBCZ-5

Manufacturer No:

ADSP-SC573BBCZ-5

Manufacturer:

Analog Devices Inc.

Description:

ARM, 2X SHARC, DDR, BGA

Datasheet:

Datasheet

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ADSP-SC573BBCZ-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    400-CSPBGA (17x17)
  • Package / Case
    400-LFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Core
    1.10V
  • Voltage - I/O
    3.30V
  • On-Chip RAM
    2MB
  • Non-Volatile Memory
    External
  • Clock Rate
    500MHz, 500MHz
  • Interface
    CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
  • Type
    Fixed/Floating Point
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    SHARC®
The ADSP-SC573BBCZ-5 is a high-performance integrated circuit chip developed by Analog Devices. It belongs to the ADSP-SC57x series of processors and offers several advantages and application scenarios. Some of them include:1. High-performance processing: The ADSP-SC573BBCZ-5 chip is built on a dual-core SHARC+ DSP architecture, which provides high-performance processing capabilities. It can handle complex algorithms and real-time processing tasks efficiently.2. Multicore processing: With its dual-core architecture, the chip enables parallel processing, allowing for faster execution of tasks. This makes it suitable for applications that require high-speed processing, such as audio and video processing, industrial automation, and motor control.3. Integrated peripherals: The chip comes with a wide range of integrated peripherals, including multiple UART, SPI, I2C, and GPIO interfaces. It also supports Ethernet, USB, and CAN bus connectivity, making it suitable for applications that require communication with other devices or systems.4. High-speed connectivity: The ADSP-SC573BBCZ-5 chip supports high-speed serial interfaces like Gigabit Ethernet and USB 2.0, enabling fast data transfer rates. This makes it suitable for applications that require high-bandwidth communication, such as networked audio systems, industrial control systems, and automotive infotainment.5. Real-time processing: The chip's architecture and processing capabilities make it well-suited for real-time applications. It can handle time-critical tasks with low latency, making it suitable for applications like audio processing, robotics, and control systems.6. Low power consumption: Despite its high-performance capabilities, the chip is designed to be power-efficient. It incorporates power management features that help optimize power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios for the ADSP-SC573BBCZ-5 chip include:1. Audio and video processing: The chip's high-performance processing and integrated peripherals make it suitable for audio and video processing applications, such as professional audio equipment, audio mixers, video surveillance systems, and multimedia devices.2. Industrial automation: The chip's real-time processing capabilities and connectivity options make it suitable for industrial automation applications, including motor control, robotics, machine vision, and process control systems.3. Automotive systems: The chip's high-speed connectivity, real-time processing, and low power consumption make it suitable for automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and in-vehicle networking.4. Communication systems: The chip's integrated peripherals and high-speed connectivity options make it suitable for communication systems, including networked audio systems, telecommunication equipment, and data acquisition systems.5. Medical devices: The chip's high-performance processing and real-time capabilities make it suitable for medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices.Overall, the ADSP-SC573BBCZ-5 chip offers high-performance processing, real-time capabilities, and a range of integrated peripherals, making it suitable for a wide range of applications that require high-speed processing, connectivity, and low power consumption.