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TMS320C6670ACYP2

TMS320C6670ACYP2

Manufacturer No:

TMS320C6670ACYP2

Manufacturer:

Texas Instruments

Description:

IC DSP FIX/FLOAT POINT 841FCBGA

Datasheet:

Datasheet

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TMS320C6670ACYP2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    841-FCBGA (24x24)
  • Package / Case
    841-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 100°C (TC)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    1.0V, 1.5V, 1.8V
  • On-Chip RAM
    6.25MB
  • Non-Volatile Memory
    ROM (128kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
  • Type
    Fixed/Floating Point
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    TMS320C66x
The TMS320C6670ACYP2 is a high-performance digital signal processor (DSP) chip developed by Texas Instruments. It offers several advantages and can be applied in various scenarios:1. High Performance: The TMS320C6670ACYP2 is designed to deliver high processing power with eight C66x DSP cores running at 1.25 GHz. This makes it suitable for computationally intensive applications that require real-time processing, such as video and image processing, radar systems, and software-defined radio.2. Multicore Architecture: The chip's multicore architecture allows for parallel processing, enabling efficient execution of complex algorithms and tasks. It supports inter-core communication and synchronization, making it suitable for applications that require distributed processing or multi-threading.3. Integrated Peripherals: The TMS320C6670ACYP2 includes various integrated peripherals, such as Ethernet, Serial RapidIO, and PCIe interfaces. These peripherals facilitate connectivity and data transfer with external devices, making it suitable for applications that require high-speed data communication, such as networking equipment and data acquisition systems.4. Scalability: The chip's architecture allows for scalability, enabling the use of multiple TMS320C6670ACYP2 chips in a system. This scalability makes it suitable for applications that require increased processing power or the ability to handle larger data sets, such as high-performance computing clusters or advanced signal processing systems.5. Software Development Tools: Texas Instruments provides a comprehensive software development kit (SDK) for the TMS320C6670ACYP2, including compilers, debuggers, and libraries. This SDK simplifies the development process and allows for efficient programming and optimization of DSP algorithms.Application scenarios for the TMS320C6670ACYP2 include:1. Wireless Infrastructure: The chip's high processing power and integrated peripherals make it suitable for wireless base stations, where it can handle complex signal processing tasks, such as modulation/demodulation, channel coding/decoding, and beamforming.2. Medical Imaging: The TMS320C6670ACYP2 can be used in medical imaging systems, such as ultrasound machines or magnetic resonance imaging (MRI) scanners, where it can process and analyze large amounts of image data in real-time.3. Video Surveillance: The chip's high-performance DSP cores and integrated peripherals make it suitable for video surveillance systems, where it can handle video encoding/decoding, object detection, and tracking tasks.4. Aerospace and Defense: The TMS320C6670ACYP2 can be used in aerospace and defense applications, such as radar systems, electronic warfare, and satellite communication, where it can process and analyze complex signals and data in real-time.5. High-Performance Computing: The chip's scalability and parallel processing capabilities make it suitable for high-performance computing applications, such as scientific simulations, data analytics, and financial modeling, where it can handle computationally intensive tasks efficiently.
TMS320C6670ACYP2 Relevant information