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TMS320C6670ACYPA2

TMS320C6670ACYPA2

Manufacturer No:

TMS320C6670ACYPA2

Manufacturer:

Texas Instruments

Description:

IC DSP FIX/FLOAT POINT 841FCBGA

Datasheet:

Datasheet

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TMS320C6670ACYPA2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    841-FCBGA (24x24)
  • Package / Case
    841-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TC)
  • Voltage - Core
    1.00V
  • Voltage - I/O
    1.0V, 1.5V, 1.8V
  • On-Chip RAM
    6.25MB
  • Non-Volatile Memory
    ROM (128kB)
  • Clock Rate
    1.2GHz
  • Interface
    EBI/EMI, Ethernet MAC, PCIe, I²C, SPI, SRIO, UART
  • Type
    Fixed/Floating Point
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    TMS320C66x
The TMS320C6670ACYPA2 is a high-performance digital signal processor (DSP) chip developed by Texas Instruments. It offers several advantages and can be applied in various scenarios:1. High Performance: The TMS320C6670ACYPA2 is designed to deliver high processing power with eight C66x DSP cores running at 1.25 GHz. This makes it suitable for computationally intensive applications that require real-time processing, such as video and image processing, radar systems, and software-defined radio.2. Multicore Architecture: The chip's multicore architecture allows for parallel processing, enabling efficient execution of complex algorithms and tasks. It supports inter-core communication and synchronization, making it suitable for applications that require distributed processing or multi-threading.3. Integrated Peripherals: The TMS320C6670ACYPA2 includes various integrated peripherals, such as Ethernet, PCIe, Serial RapidIO, and DDR3 memory interfaces. These peripherals simplify system integration and enable high-speed data transfer, making it suitable for networking, communication, and data-intensive applications.4. Scalability: The chip's architecture allows for scalability, enabling the use of multiple TMS320C6670ACYPA2 chips in a system to achieve even higher processing power. This makes it suitable for applications that require massive parallel processing, such as high-performance computing, cloud computing, and data centers.5. Software Development Tools: Texas Instruments provides a comprehensive software development kit (SDK) and libraries for the TMS320C6670ACYPA2, making it easier for developers to program and optimize their applications. The SDK includes tools for debugging, profiling, and performance analysis, enhancing the development process.Application scenarios for the TMS320C6670ACYPA2 include:1. Wireless Infrastructure: The chip can be used in base stations and wireless access points to handle signal processing tasks, such as modulation/demodulation, channel coding/decoding, and beamforming.2. Video and Image Processing: The high processing power and integrated peripherals of the chip make it suitable for real-time video and image processing applications, such as video surveillance, medical imaging, and video transcoding.3. Radar Systems: The TMS320C6670ACYPA2 can be used in radar systems for tasks like signal processing, target detection, and tracking. Its high-performance capabilities enable real-time processing of radar data.4. Software-Defined Radio (SDR): The chip's multicore architecture and high processing power make it suitable for SDR applications, where it can handle tasks like digital modulation/demodulation, channel coding/decoding, and spectrum sensing.5. High-Performance Computing: The scalability and parallel processing capabilities of the chip make it suitable for high-performance computing applications, such as scientific simulations, data analytics, and machine learning.Overall, the TMS320C6670ACYPA2 offers high performance, scalability, and integrated peripherals, making it suitable for a wide range of applications that require real-time processing and high computational power.
TMS320C6670ACYPA2 Relevant information