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EPM7512BFI256-7 Specifications
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TypeParameter
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Supplier Device Package256-FBGA (17x17)
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Package / Case256-BGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Number of I/O212
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Number of Gates10000
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Number of Macrocells512
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Number of Logic Elements/Blocks32
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Voltage Supply - Internal2.375V ~ 2.625V
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Delay Time tpd(1) Max7.5 ns
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Programmable TypeIn System Programmable
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusObsolete
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SeriesMAX® 7000B
The EPM7512BFI256-7 is a specific model of integrated circuit (IC) chip manufactured by Intel. It belongs to the MAX 7000 series of programmable logic devices (PLDs). Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The EPM7512BFI256-7 is a PLD, which means it can be programmed to perform specific logic functions. This flexibility allows for customization and adaptation to various applications. 2. High-density integration: With 512 macrocells and 12,288 usable gates, this chip offers a high level of integration, enabling complex logic designs to be implemented on a single device. 3. Low power consumption: The EPM7512BFI256-7 is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 4. Fast performance: This chip offers high-speed performance, allowing for quick execution of logic functions.Application scenarios: 1. Digital circuit design: The EPM7512BFI256-7 can be used in various digital circuit designs, such as in telecommunications, industrial automation, consumer electronics, and automotive applications. It can implement complex logic functions, including data processing, control, and interfacing. 2. Prototyping and development: The programmability of this chip makes it suitable for prototyping and development of digital systems. It allows engineers to quickly test and iterate their designs before moving to production. 3. System-on-Chip (SoC) integration: The EPM7512BFI256-7 can be used as a part of a larger SoC design, where it can handle specific logic functions or act as a glue logic to interface different components. 4. Replacement for discrete logic: In some cases, this chip can replace multiple discrete logic components, reducing the overall component count, board space, and cost.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and context of the project. It is recommended to consult the datasheet and technical documentation provided by Intel for detailed information on the capabilities and recommended usage of the EPM7512BFI256-7 chip.