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EPM7512AEBC256-7 Specifications
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TypeParameter
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Supplier Device Package256-BGA (27x27)
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Package / Case256-LBGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Number of I/O212
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Number of Gates10000
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Number of Macrocells512
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Number of Logic Elements/Blocks32
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Voltage Supply - Internal3V ~ 3.6V
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Delay Time tpd(1) Max7.5 ns
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Programmable TypeIn System Programmable
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusObsolete
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SeriesMAX® 7000A
The EPM7512AEBC256-7 is a specific model of integrated circuit (IC) chip manufactured by Intel. It belongs to the MAX 7000 series of programmable logic devices (PLDs). Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The EPM7512AEBC256-7 is a PLD, which means it can be programmed to perform specific logic functions. This flexibility allows for customization and adaptation to various applications. 2. High-density integration: This chip offers a high level of integration, allowing for the implementation of complex logic functions in a single device. It has 512 macrocells, which can be used for various purposes. 3. Low power consumption: The EPM7512AEBC256-7 is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. Fast performance: With a maximum propagation delay of 7.5 ns, this chip offers fast performance, enabling real-time processing and high-speed applications.Application scenarios: 1. Digital circuit design: The EPM7512AEBC256-7 can be used in various digital circuit designs, such as in telecommunications, industrial automation, consumer electronics, and automotive applications. It can implement complex logic functions, such as data routing, signal processing, and control logic. 2. Prototyping and development: The programmability of this chip makes it suitable for prototyping and development of digital systems. It allows engineers to quickly test and iterate their designs before moving to production. 3. Replacement for discrete logic components: The EPM7512AEBC256-7 can replace multiple discrete logic components, such as logic gates, flip-flops, and multiplexers, reducing the overall component count and simplifying the circuit design. 4. System-on-Chip (SoC) integration: This chip can be used as a part of a larger system-on-chip design, where it can handle specific logic functions while other components handle other tasks like microprocessing or memory management.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information on the capabilities and recommended usage of the EPM7512AEBC256-7 chip.