In Stock : 0
Please send RFQ , we will respond immediately.
EPM7512AEFC256-7 Specifications
-
TypeParameter
-
Supplier Device Package256-FBGA (17x17)
-
Package / Case256-BGA
-
Mounting TypeSurface Mount
-
Operating Temperature0°C ~ 70°C (TA)
-
Number of I/O212
-
Number of Gates10000
-
Number of Macrocells512
-
Number of Logic Elements/Blocks32
-
Voltage Supply - Internal3V ~ 3.6V
-
Delay Time tpd(1) Max7.5 ns
-
Programmable TypeIn System Programmable
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusObsolete
-
SeriesMAX® 7000A
The EPM7512AEFC256-7 is a specific model of integrated circuit (IC) chip manufactured by Intel. It belongs to the MAX 7000 series of programmable logic devices (PLDs). Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The EPM7512AEFC256-7 is a PLD, which means it can be programmed to perform specific logic functions. This flexibility allows for customization and adaptation to various applications. 2. High-density integration: With 512 macrocells and 12,288 usable gates, this chip offers a high level of integration, enabling complex logic designs to be implemented on a single device. 3. Low power consumption: The EPM7512AEFC256-7 is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 4. Fast performance: This chip offers high-speed performance, allowing for quick execution of logic functions.Application scenarios: 1. Digital circuit design: The EPM7512AEFC256-7 can be used in various digital circuit designs, such as in telecommunications, networking, and industrial control systems. Its programmability allows for the implementation of specific logic functions required in these applications. 2. Prototyping and development: PLDs like the EPM7512AEFC256-7 are often used in prototyping and development stages of electronic systems. They provide a flexible platform for testing and validating different logic designs before finalizing a dedicated hardware solution. 3. System-on-Chip (SoC) integration: The high-density integration and programmability of this chip make it suitable for integration into larger systems-on-chip. It can be used as a component to implement specific functions within a larger system. 4. Replacement for obsolete components: In some cases, the EPM7512AEFC256-7 can be used as a drop-in replacement for obsolete or hard-to-find components. Its programmability allows for the replication of the required logic functions, providing a solution when original components are no longer available.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and context of the project. It is recommended to consult the datasheet and technical documentation provided by Intel for detailed information on the capabilities and recommended applications of the EPM7512AEFC256-7 chip.