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EPM570F256C3N

EPM570F256C3N

Manufacturer No:

EPM570F256C3N

Manufacturer:

Intel

Description:

IC CPLD 440MC 5.4NS 256FBGA

Datasheet:

Datasheet

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EPM570F256C3N Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FBGA (17x17)
  • Package / Case
    256-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Number of I/O
    160
  • Number of Macrocells
    440
  • Number of Logic Elements/Blocks
    570
  • Voltage Supply - Internal
    2.5V, 3.3V
  • Delay Time tpd(1) Max
    5.4 ns
  • Programmable Type
    In System Programmable
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MAX® II
The EPM570F256C3N is an integrated circuit chip from the MAX II family of programmable logic devices (PLDs) manufactured by Intel (formerly Altera). Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The EPM570F256C3N is a field-programmable gate array (FPGA), which means it can be reprogrammed even after being manufactured. This flexibility allows for rapid prototyping, design changes, and customization. 2. High logic density: With 570,000 logic elements (LEs), this chip offers a large amount of programmable resources, enabling the implementation of complex digital designs. 3. Low power consumption: The MAX II family of chips is known for its low power consumption, making it suitable for battery-powered or power-sensitive applications. 4. Embedded memory: The EPM570F256C3N includes 256 kilobits (Kb) of embedded memory, which can be used for data storage or as lookup tables for implementing complex functions. 5. Integrated features: The chip includes various built-in features like phase-locked loops (PLLs), clock dividers, and I/O pins, which simplify the design process and reduce the need for external components.Application scenarios: 1. Prototyping and development boards: The EPM570F256C3N can be used on development boards to quickly prototype and test digital designs before moving to production. 2. Industrial automation: The chip's high logic density and low power consumption make it suitable for implementing control systems, motor control, and sensor interfacing in industrial automation applications. 3. Communications and networking: The EPM570F256C3N can be used to implement various communication protocols, such as Ethernet, USB, or serial interfaces, making it suitable for networking equipment and communication devices. 4. Consumer electronics: The chip can be used in consumer electronics products like set-top boxes, gaming consoles, or multimedia devices, where programmability and flexibility are desired. 5. Automotive applications: The EPM570F256C3N can be used in automotive systems for functions like engine control, infotainment systems, or driver assistance systems, where reliability, customization, and low power consumption are important.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.
EPM570F256C3N Relevant information