Share
In Stock : 0
Please send RFQ , we will respond immediately.
XCR3512XL-10FGG324I Specifications
-
TypeParameter
-
Supplier Device Package324-FBGA (23x23)
-
Package / Case324-BBGA
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 85°C (TA)
-
Number of I/O260
-
Number of Gates12000
-
Number of Macrocells512
-
Number of Logic Elements/Blocks32
-
Voltage Supply - Internal2.7V ~ 3.6V
-
Delay Time tpd(1) Max9 ns
-
Programmable TypeIn System Programmable (min 1K program/erase cycles)
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusActive
-
SeriesCoolRunner XPLA3
The XCR3512XL-10FGG324I is an integrated circuit chip from Xilinx, which belongs to the XC3000 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XCR3512XL-10FGG324I offers a high logic density, allowing for the implementation of complex digital circuits on a single chip. 2. Flexibility: Being an FPGA, this chip provides the flexibility to be reprogrammed and reconfigured as per the application requirements, making it suitable for a wide range of applications. 3. Fast Processing: The XCR3512XL-10FGG324I offers fast processing capabilities, enabling it to handle real-time applications and high-speed data processing. 4. Low Power Consumption: This chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 5. Integrated Features: It includes various integrated features like configurable I/O pins, memory blocks, and digital signal processing (DSP) blocks, which enhance its versatility and functionality.Application Scenarios: 1. Embedded Systems: The XCR3512XL-10FGG324I can be used in embedded systems for various applications like industrial automation, robotics, and automotive electronics. Its flexibility allows for customization and adaptation to specific requirements. 2. Communications: This chip can be utilized in communication systems, such as wireless base stations, network routers, and data transmission equipment. Its high logic density and fast processing capabilities enable efficient data handling and signal processing. 3. Image and Video Processing: The XCR3512XL-10FGG324I can be employed in image and video processing applications, including video surveillance systems, image recognition, and multimedia devices. Its high-speed processing and integrated DSP blocks enable real-time image and video processing. 4. Aerospace and Defense: The chip's reliability, low power consumption, and reprogrammability make it suitable for aerospace and defense applications. It can be used in avionics systems, radar systems, and military communication equipment. 5. Test and Measurement: The XCR3512XL-10FGG324I can be utilized in test and measurement equipment, such as oscilloscopes, logic analyzers, and signal generators. Its flexibility allows for the implementation of various testing and measurement functions on a single chip.These are just a few examples of the advantages and application scenarios of the XCR3512XL-10FGG324I chip. Its versatility and features make it suitable for a wide range of digital circuit applications.