XCR3512XL-10FTG256I

XCR3512XL-10FTG256I

Manufacturer No:

XCR3512XL-10FTG256I

Manufacturer:

AMD

Description:

IC CPLD 512MC 9NS 256FTBGA

Datasheet:

Datasheet

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XCR3512XL-10FTG256I Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FTBGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Number of I/O
    212
  • Number of Gates
    12000
  • Number of Macrocells
    512
  • Number of Logic Elements/Blocks
    32
  • Voltage Supply - Internal
    2.7V ~ 3.6V
  • Delay Time tpd(1) Max
    9 ns
  • Programmable Type
    In System Programmable (min 1K program/erase cycles)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    CoolRunner XPLA3
The XCR3512XL-10FTG256I is an integrated circuit chip from Xilinx, which belongs to the XC3000 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-density FPGA: The XCR3512XL-10FTG256I offers a high logic density, allowing for the implementation of complex digital designs. 2. Flexible and reprogrammable: FPGAs can be reprogrammed multiple times, making them suitable for prototyping and iterative design processes. 3. Customizable hardware: The chip allows for the creation of custom digital circuits, enabling designers to implement specific functionalities as per their requirements. 4. Fast processing: The XCR3512XL-10FTG256I offers high-speed performance, making it suitable for applications that require real-time processing and low latency. 5. Low power consumption: This chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.Application scenarios: 1. Digital signal processing (DSP): The XCR3512XL-10FTG256I can be used in applications that require real-time processing of digital signals, such as audio and video processing, telecommunications, and image processing. 2. Embedded systems: The chip can be utilized in embedded systems, where it can serve as a customizable hardware platform for implementing various functionalities like control systems, data acquisition, and sensor interfacing. 3. Prototyping and development: FPGAs are commonly used in the early stages of hardware development to quickly prototype and test digital designs before moving to dedicated ASIC (Application-Specific Integrated Circuit) development. 4. High-performance computing: The XCR3512XL-10FTG256I can be employed in high-performance computing applications, such as cryptography, data encryption, and parallel processing, where its high logic density and fast processing capabilities are advantageous. 5. Aerospace and defense: FPGAs find applications in aerospace and defense systems, including radar systems, avionics, and military communication systems, due to their reprogrammability, high performance, and reliability.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of a particular project.