XCR3512XL-10FG324C

XCR3512XL-10FG324C

Manufacturer No:

XCR3512XL-10FG324C

Manufacturer:

AMD

Description:

IC CPLD 512MC 9NS 324FBGA

Datasheet:

Datasheet

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XCR3512XL-10FG324C Specifications

  • Type
    Parameter
  • Supplier Device Package
    324-FBGA (23x23)
  • Package / Case
    324-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Number of I/O
    260
  • Number of Gates
    12000
  • Number of Macrocells
    512
  • Number of Logic Elements/Blocks
    32
  • Voltage Supply - Internal
    3V ~ 3.6V
  • Delay Time tpd(1) Max
    9 ns
  • Programmable Type
    In System Programmable (min 1K program/erase cycles)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    CoolRunner XPLA3
The XCR3512XL-10FG324C is an integrated circuit chip from Xilinx, which belongs to the XC3000 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XCR3512XL-10FG324C offers a high logic density, allowing for the implementation of complex digital circuits on a single chip. 2. Flexibility: Being an FPGA, it provides the flexibility to be reprogrammed and reconfigured even after deployment, making it suitable for prototyping and development. 3. Fast Processing: The chip offers fast processing capabilities, enabling it to handle real-time applications and high-speed data processing. 4. Low Power Consumption: It is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 5. Integrated Features: The XCR3512XL-10FG324C includes various integrated features like configurable I/O pins, memory blocks, and digital signal processing (DSP) blocks, enhancing its versatility.Application Scenarios: 1. Prototyping and Development: The XCR3512XL-10FG324C can be used in prototyping and development of digital circuits, allowing engineers to quickly test and iterate their designs. 2. Digital Signal Processing: With its integrated DSP blocks, the chip is suitable for applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. 3. Industrial Automation: The FPGA can be utilized in industrial automation systems for tasks like control and monitoring, motor control, and sensor interfacing. 4. Communications: It can be employed in communication systems, including wireless communication, networking, and data transmission, where high-speed processing and flexibility are required. 5. Embedded Systems: The XCR3512XL-10FG324C can be used in embedded systems, such as automotive electronics, medical devices, and consumer electronics, where customization, low power consumption, and real-time processing are essential.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.