XCR3512XL-12FT256I

XCR3512XL-12FT256I

Manufacturer No:

XCR3512XL-12FT256I

Manufacturer:

AMD

Description:

IC CPLD 512MC 10.8NS 256FTBGA

Datasheet:

Datasheet

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XCR3512XL-12FT256I Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FTBGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Number of I/O
    212
  • Number of Gates
    12000
  • Number of Macrocells
    512
  • Number of Logic Elements/Blocks
    32
  • Voltage Supply - Internal
    2.7V ~ 3.6V
  • Delay Time tpd(1) Max
    10.8 ns
  • Programmable Type
    In System Programmable (min 1K program/erase cycles)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    CoolRunner XPLA3
The XCR3512XL-12FT256I is an integrated circuit chip from Xilinx, which belongs to the XC3000 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XCR3512XL-12FT256I offers a high logic density, allowing for the implementation of complex digital circuits on a single chip. 2. Flexibility: Being an FPGA, this chip offers the advantage of reprogrammability. It can be reconfigured multiple times to suit different applications, making it highly flexible. 3. Fast Processing: The XCR3512XL-12FT256I provides fast processing capabilities, enabling it to handle real-time applications and high-speed data processing. 4. Low Power Consumption: This chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 5. Integrated Features: It includes various integrated features like configurable I/O pins, memory blocks, and digital signal processing (DSP) blocks, which enhance its functionality and ease of use.Application Scenarios: 1. Digital Signal Processing: The XCR3512XL-12FT256I can be used in applications that require real-time signal processing, such as audio and video processing, telecommunications, and software-defined radio. 2. Embedded Systems: It can be utilized in embedded systems for controlling and interfacing with various peripherals, sensors, and actuators. Its reprogrammability allows for easy adaptation to changing requirements. 3. Prototyping and Development: The chip is commonly used in prototyping and development of digital circuits and systems. Its flexibility and high logic density make it suitable for quickly testing and iterating designs. 4. Industrial Automation: The XCR3512XL-12FT256I can be employed in industrial automation systems for controlling and monitoring processes, machinery, and sensors. 5. Aerospace and Defense: The chip finds applications in aerospace and defense systems, including avionics, radar systems, and secure communication systems, where high performance and reliability are crucial.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of a particular project.