XCR3256XL-10FTG256I

XCR3256XL-10FTG256I

Manufacturer No:

XCR3256XL-10FTG256I

Manufacturer:

AMD

Description:

IC CPLD 256MC 9.1NS 256FTBGA

Datasheet:

Datasheet

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XCR3256XL-10FTG256I Specifications

  • Type
    Parameter
  • Number of Gates
    6000
  • Number of Logic Elements/Blocks
    16
  • Supplier Device Package
    256-FTBGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Number of I/O
    164
  • Number of Macrocells
    256
  • Voltage Supply - Internal
    2.7V ~ 3.6V
  • Delay Time tpd(1) Max
    9.1 ns
  • Programmable Type
    In System Programmable (min 1K program/erase cycles)
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    CoolRunner XPLA3
The XCR3256XL-10FTG256I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx CoolRunner XPLA3 family of CPLDs (Complex Programmable Logic Devices). Here are some advantages and application scenarios of this chip:Advantages: 1. Low power consumption: The CoolRunner XPLA3 family is known for its low power characteristics, making it suitable for battery-powered or power-sensitive applications. 2. High performance: The XCR3256XL-10FTG256I offers fast operation and efficient logic utilization, enabling high-performance designs. 3. In-system programmability: The chip can be programmed and reprogrammed in-circuit, allowing for flexibility and ease of design iteration. 4. High logic capacity: With 256 macrocells, the XCR3256XL-10FTG256I provides a decent amount of logic resources for implementing complex digital designs. 5. Small form factor: The chip comes in a small footprint package, making it suitable for space-constrained designs.Application scenarios: 1. Embedded systems: The XCR3256XL-10FTG256I can be used in various embedded systems, such as industrial control systems, automotive electronics, and consumer electronics, where low power consumption and high performance are desired. 2. Communication devices: It can be utilized in networking equipment, routers, switches, and other communication devices to implement custom logic functions or interface protocols. 3. Test and measurement equipment: The chip can be used in test and measurement instruments to implement signal processing, data acquisition, or control functions. 4. Robotics and automation: It can be employed in robotics and automation systems for control and coordination of various subsystems. 5. Prototyping and development: The XCR3256XL-10FTG256I can be used in prototyping and development boards to quickly implement and test digital logic designs.It's important to note that the specific application scenarios may vary depending on the requirements and design goals of a particular project.