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ATPL250AG55J19-R

ATPL250AG55J19-R

Manufacturer No:

ATPL250AG55J19-R

Manufacturer:

Microchip Technology

Description:

PL250A-AKU-R SAMG55J19A-MUT LQFP

Datasheet:

Datasheet

Delivery:

Payment:

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ATPL250AG55J19-R Specifications

  • Type
    Parameter
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Interface
    SPI
  • RAM Size
    -
  • Controller Series
    -
  • Program Memory Type
    -
  • Core Processor
    External
  • Applications
    Power Line Communications
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    Surface Mount
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The ATPL250AG55J19-R integrated circuit chips offer several advantages and can be used in various application scenarios. Some of the advantages and application scenarios are as follows:Advantages: 1. High Sensitivity: These chips provide high sensitivity, which allows for long-range communication and reliable data transmission over long distances. 2. Low Power Consumption: They have low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 3. Multi-Standard Support: The chips support multiple wireless communication standards, including narrowband and wideband modes, making them versatile for different application requirements. 4. Robust Performance: They offer excellent noise immunity and signal integrity, ensuring reliable communication, even in challenging and noisy environments. 5. Enhanced Security: The chips feature advanced security mechanisms, including encryption and authentication protocols, ensuring secure and private data transmission.Application Scenarios: 1. Smart Grids: The chips can be used in smart grid systems for advanced metering infrastructure, allowing for reliable and secure communication between smart meters and the central management system. 2. Industrial Automation: They are suitable for industrial automation applications, such as remote monitoring and control systems, enabling seamless and reliable communication between sensors, actuators, and control units. 3. IoT Devices: The chips can be integrated into Internet of Things (IoT) devices, facilitating long-range communication between connected devices for applications like smart homes, asset tracking, and environmental monitoring. 4. Wireless Sensor Networks: They are ideal for wireless sensor networks used in applications such as agriculture, environmental monitoring, and industrial monitoring, enabling long-range data transmission and efficient utilization of energy. 5. Automotive Telematics: The chips can be used in automotive telematics systems for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, enhancing road safety and enabling advanced features like collision avoidance and traffic optimization.Overall, the ATPL250AG55J19-R integrated circuit chips offer advantages of high sensitivity, low power consumption, and robust performance, making them suitable for a wide range of applications that require reliable wireless communication.
ATPL250AG55J19-R Relevant information