In Stock : 0
Please send RFQ , we will respond immediately.
NS9215B-0-I150 Specifications
-
TypeParameter
-
Number of I/O108
-
InterfaceEBI/EMI, Ethernet, DMA, HDLC, I²C, SPI, UART
-
Supplier Device Package265-LF-XBGA (15x15)
-
Package / Case265-LFBGA
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 85°C
-
Voltage - Supply1.8V, 3.3V
-
RAM SizeExternal
-
Controller Series-
-
Program Memory TypeExternal Program Memory
-
Core ProcessorARM9®
-
ApplicationsNetwork Processor
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusNot For New Designs
-
SeriesNET+ARM®
The 73S1210F-68IM/F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transfer rates, making them suitable for applications that require fast and efficient data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into small form factor devices or applications with limited space. 4. Versatility: The chips support various communication protocols, making them versatile and suitable for a wide range of applications. 5. Robustness: These chips are designed to be highly reliable and durable, ensuring stable performance even in challenging environments.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication, enabling connectivity and data transfer between devices in smart homes, industrial automation, healthcare monitoring, etc. 2. Wireless Sensor Networks: These chips can be utilized in wireless sensor networks for collecting and transmitting data from sensors to a central hub or server, enabling applications such as environmental monitoring, asset tracking, and smart agriculture. 3. Industrial Automation: The chips can be employed in industrial automation systems for wireless communication between machines, enabling real-time monitoring, control, and data exchange in manufacturing plants or industrial processes. 4. Smart Grids: These chips can be used in smart grid systems for communication between smart meters, enabling efficient energy management, remote meter reading, and demand response. 5. Wearable Devices: The chips can be integrated into wearable devices such as fitness trackers, smartwatches, or healthcare monitoring devices, enabling wireless connectivity and data transfer to smartphones or other devices.These are just a few examples of the advantages and application scenarios of the 73S1210F-68IM/F integrated circuit chips, and their usage can vary depending on specific requirements and industry needs.
NS9215B-0-I150 Relevant information
-
TLE98442QXXUMA1
Analog Devices Inc. -
TLE9872QTW40XUMA1
Analog Devices Inc. -
TLE98442QXXUMA1
Analog Devices Inc. -
ASC8848AETE
NXP Semiconductors -
CY8C20246A-24LKXIKA
Cypress Semiconductor Corp -
CY8C20236A-24LKXIKM
Cypress Semiconductor Corp -
MM908E626AVPEK
NXP Semiconductors -
MM912I637AV1EP
NXP Semiconductors -
MM908E621ACPEK
NXP Semiconductors -
CYUSB3302-68LTXC
Cypress Semiconductor Corp