NS9215B-0-I150

NS9215B-0-I150

Manufacturer No:

NS9215B-0-I150

Manufacturer:

Digi

Description:

IC ARM9 MICROPROCESSOR 265BGA

Datasheet:

Datasheet

Delivery:

Payment:

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NS9215B-0-I150 Specifications

  • Type
    Parameter
  • Number of I/O
    108
  • Interface
    EBI/EMI, Ethernet, DMA, HDLC, I²C, SPI, UART
  • Supplier Device Package
    265-LF-XBGA (15x15)
  • Package / Case
    265-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    1.8V, 3.3V
  • RAM Size
    External
  • Controller Series
    -
  • Program Memory Type
    External Program Memory
  • Core Processor
    ARM9®
  • Applications
    Network Processor
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Not For New Designs
  • Series
    NET+ARM®
The 73S1210F-68IM/F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transfer rates, making them suitable for applications that require fast and efficient data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into small form factor devices or applications with limited space. 4. Versatility: The chips support various communication protocols, making them versatile and suitable for a wide range of applications. 5. Robustness: These chips are designed to be highly reliable and durable, ensuring stable performance even in challenging environments.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication, enabling connectivity and data transfer between devices in smart homes, industrial automation, healthcare monitoring, etc. 2. Wireless Sensor Networks: These chips can be utilized in wireless sensor networks for collecting and transmitting data from sensors to a central hub or server, enabling applications such as environmental monitoring, asset tracking, and smart agriculture. 3. Industrial Automation: The chips can be employed in industrial automation systems for wireless communication between machines, enabling real-time monitoring, control, and data exchange in manufacturing plants or industrial processes. 4. Smart Grids: These chips can be used in smart grid systems for communication between smart meters, enabling efficient energy management, remote meter reading, and demand response. 5. Wearable Devices: The chips can be integrated into wearable devices such as fitness trackers, smartwatches, or healthcare monitoring devices, enabling wireless connectivity and data transfer to smartphones or other devices.These are just a few examples of the advantages and application scenarios of the 73S1210F-68IM/F integrated circuit chips, and their usage can vary depending on specific requirements and industry needs.