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FDC37C922QFP

FDC37C922QFP

Manufacturer No:

FDC37C922QFP

Manufacturer:

SMSC

Description:

ULTRA I/O CONTROLLER

Datasheet:

Datasheet

Delivery:

Payment:

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FDC37C922QFP Specifications

  • Type
    Parameter
  • Interface
    -
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Voltage - Supply
    -
  • RAM Size
    -
  • Controller Series
    -
  • Program Memory Type
    -
  • Core Processor
    -
  • Applications
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The CY90553BPMC-G-279-BNDE1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transfer and processing capabilities, making them suitable for applications that require fast and efficient data handling. 2. Low Power Consumption: The chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Small Form Factor: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: These chips support a wide range of communication protocols and interfaces, making them versatile for different applications. 5. Robustness: The chips are designed to be reliable and durable, ensuring stable performance even in harsh operating conditions.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication, data processing, and connectivity. 2. Wearable Devices: These chips can be integrated into wearable devices such as smartwatches, fitness trackers, and healthcare monitoring devices to enable wireless communication and data processing. 3. Industrial Automation: The chips can be used in industrial automation systems for data acquisition, control, and communication. 4. Automotive Electronics: These chips can be utilized in automotive applications for vehicle-to-vehicle communication, sensor data processing, and connectivity. 5. Consumer Electronics: The chips can be used in various consumer electronic devices such as smartphones, tablets, and gaming consoles for wireless communication and data processing.Overall, the CY90553BPMC-G-279-BNDE1 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in IoT, wearable devices, industrial automation, automotive electronics, and consumer electronics.
FDC37C922QFP Relevant information